3D X-Ray Inspection System with integrated AOI Option

30 October 2012 - GOEPEL electronic introduced a revolutionary AOI option as integral part of its 3D x-ray inspection (AXI) system OptiCon X-Line 3D. The combination provides users the opportunity to significantly increase test coverage by means of optical test technologies. In contrast to other vendors’ combined inspection systems (AOI/AXI) solder joint inspection with OptiCon X-Line 3D is not only applied for hidden but all solder joints on electronic assemblies.

This guarantees an ideal solder joint inspection avoiding AOI-specific reflections and shadows close to IPC-A610 specifications. Hence, soldering defects, hard to detect via AOI, can be safely found.

In the OptiCon X-Line 3D, AOI technology is utilised for all inspection tasks impossible to execute through AXI, such as polarity check, character and colour recognition as well as data matrix and barcode reading. These are explored by an AOI module, well-proven in GOEPEL electronic’s OptiCon AOI system series.

The intelligent combination of x-ray and optical inspection guarantees a nearly 100% visual test coverage“, says Andreas Tuerk, Team Manager for GOEPEL electronic’s AXI System Division. “As much x-ray inspection as possible and complementary AOI as necessary means an optimization of the entire inspection process. In addition, it provides an enormously fast optical test of the entire PCB.”