Latest Test and Measurement News

AOI with shadow-free 3D Measurement Technology

16 June 2014 - GOEPEL electronic enhanced the OptiCon AOI systems with a revolutionary 3D measurement technology. The “3D EyeZ” sensor module of the OptiCon Advanced Line 3D is based on a Telecentric Multi Spot Array (TMSA), which measures the height of assemblies and solder joints by movable scanning. Due to the orthogonal and telecentric projection and viewing direction, error-free measuring is possible even in the gaps between the closest of components. In addition, this technology guarantees the independence of surface properties of components, solder joints and the PCB.

As well as the 2D inspection tasks of a standard AOI system, solder volume, wetting angle, height and coplanarity of components can still be measured by all systems of the OptiCon family.

Further outstanding features of 3D EyeZ are the freely selectable X/Y resolution as well as a maximum measurement speed of 70cm²/s. The integration is possible both in-line systems and in the well-known stand-alone AOI system the OptiCon Basic Line.

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