This website uses cookies to implement certain functions. If you use this website you agree to our Privacy Policy.
News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation.  

Newsletter

Register to our newsletter
Every two weeks -
all news at a glance
captcha 

Latest Test and Measurement News

Inline X-ray System for High-Throughput Wire Bond Inspection

Viscom X7056 IIBO08 October 2020 – Viscom introduced the new X7056-II BO system, which inspects bond wires optically and radiographically in an inline system at maximum inspection depth, ensures comprehensive inspection of power semiconductors and encapsulated sensor elements alike. The new system effectively combines optical wire bond control with X-ray inspection to reliably and precisely inspect wire bonds – even enclosed ones – and concealed solder joints beneath chips.

The unique combination of AOI and AXI in a single system ensures high-throughput handling to meet the most stringent cycle time requirements at a maximum inspection depth.

Tapes and wires, whether thick or thin, are inspected, as is the soldering quality of the dies. The high-resolution sensor technology means the scope of inspection covers all bond points and wires, as well as open and concealed connection points, so that the quality of wire runs, dies and component layers, damage and position deviations as well as voids in surface soldering can be detected with absolute certainty. The standard library contains all relevant inspection patterns for die bonds, ball-wedge, wedge-wedge and security bonds for very effective inspection program generation.

Viscom’s new bond inspection system offers an ideal solution for the increasing demand for X-ray inspection in the bond area. The system is designed to be used in the production of high-end electronics and is ideal for installation in final assembly for power electronics, circuits, sensor construction and packaging to ensure 100% quality control. The Viscom range is rounded off by powerful verification and evaluation of statistical process control.

www.viscom.com/



Related Articles:

Upcoming Events

electronica 2020
Online only
10 to 13 November
Semicon Europa 2020
Online only
10 to 13 November
SPS/IPC/DRIVES 2020
Online only
24 to 26 November
Advertising
Advertising

Social Media

twitter_follow_420x50px