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Latest Test and Measurement NewsBoundary Scan Testing of DDR4 DIMM Sockets01 February 2018 - With the CION LX modules/DIMM288-4 GOEPEL electronic presents a new module for enhanced testing of standard DDR4 DIMM sockets. The module is inserted directly into the DDR4 socket of a device under test and is integrated to produce the enhanced boundary scan test using the boundary scan chain. This allows short circuits and unconnected pins in particular to be found easily. AXI System for larger electronic Assemblies31 January 2018 – Viscom AG unveiled the X8068 SL X-ray inspection system designed for the requirements of electronics manufacturers that produce in-line larger printed circuit boards, various power electronics and massive components, especially for the growing mobility market. This production demands a highly precise, nondestructive X-ray inspection that inspects an entire bandwidth of inspection objects quickly and reliably. Add 24 High Resolution Channels to your Oscilloscope30 January 2018 — The SAM40 add-on of Teledyne LeCroy provides up to 24 input channels for low frequency (sensor signal) acquisition and analysis. It connects to a 4 or 8 channel Teledyne LeCroy 12-bit resolution high definition oscilloscope (HD4096 HDOs and MDAs) to provide Analog+Digital+Sensor (up to 8+16+24 channel) acquisitions. This capability is ideal for system debug and analysis of deeply embedded, electromechanical, and mechatronic designs and other applications. Inline X-ray Inspection of BGAs, LGAs or THT-Components29 January 2018 - Omron’s VT-X750 Automatic X-ray Inspection system, incorporates the latest solution for manufacturers desiring high quality, in-line, automated X-ray inspection on PCBs, containing components such as BGAs or LGAs and through-hole connectors. Traditional X-ray technologies are limited in inspecting components like BGAs, LGAs or THT-components. Omron’s VT-X750 incorporates ‘Computed Tomography’ (CT), specifically to provide high-precision, X-ray imaging to perform precise and reliable analysis of these hidden soldered areas. Automotive Test Functions for MSO Oscilloscopes26 January 2017 – Tektronix released automotive-specific software solutions for the 5 Series MSO mixed signal oscilloscope designed to speed up validation and debug and shorten design cycles for the complex electronics systems found in next-generation vehicles. These new automotive solutions take full advantage of key 5 Series MSO innovations including up to 8 channels, 12-bit resolution and its massive high-definition capacitive touch display and highly intuitive user interface. High Density PXI SMU for the Semiconductor Test System25 January 2018 – National Instruments (NI) announced the PXIe-4163 high-density source measure unit (SMU), which provides six times more DC channel density than previous NI PXI SMUs for testing RF, MEMS, and mixed-signal and other analog semiconductor components. The new PXIe-4163 SMU delivers increased DC channel density for higher parallelism in multisite applications and lab-grade measurement quality in a production-ready form factor. “Super-Sharp” Option for Test Probes24 January 2018 - Multitest’s Super-Sharp Option for Quad Tech probes provides an increase in test cell throughput and maintains the fidelity of the test signal over longer uninterrupted run times for higher yields. Multitest makes these advantages available to customers at no additional cost. The Super-Sharp feature option is an increase in the sharpness of the probe tip while making the probe tip surface smoother. More Articles ...
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