|
||||
News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation. | ||||
Main MenuNewsletterNews AreaInfo AreaWeblinksProduct Focus |
Readers Top 5 News of last 30 days
Latest Test and Measurement NewsSpecial Oscilloscope Offer for Education Market24 May 2011 – Agilent Technologies offers InfiniiVision X-Series oscilloscopes with a special discount for educators. The offer is applicable for all oscilloscopes purchased before Aug. 31, 2011. Probe Card for Wafer-Level Chip-Scale Packages23 May 2011— Cascade Microtech announced the first in the series of Viper probe cards. Viper probe cards will be used for test of high-volume production wafer-level chip-scale packaged devices (WLCSP). Viper’s unique probe pin is integrated into Cascade Microtech’s patented laminated housing technology to deliver consistent and superior electrical results that improve production yields and reduce overall cost-of-ownership. DisplayPort 1.2 Source Compliance and Validation Software23 May 2011 – Agilent Technologies announced the industry’s first DisplayPort 1.2 source compliance and validation software. The software runs on Agilent’s industry-leading Infiniium oscilloscopes and provides the complete compliance test suite for the extensive physical-layer tests required for DisplayPort 1.2 source devices. Multifunctional Boundary Scan Controller23 May 2011 - GOEPEL electronic introduced SFX/COMBO1149-(x), the first desktop compact controller within the framework of the Boundary Scan hardware platform SCANFLEX. The multifunctional controller enables the combination of numerous strategies for testing, programming as well as design validation, and is ready to support new and upcoming standards such as IEEE 1149.7 and chip embedded instrumentation (IEEE P1687). Highest scalability and future reliability are ensured by the integrated hardware extension slots. Test Handler upgradeable from Engineering to High-Volume20 May 2011 - Multitest announced the new MT2168 test handler. Due to its scalable design the base unit configuration can be adjusted to the actual requirements – not only at the initial installation, but also later, e.g. if the MT2168 is moved from engineering to a high-volume site. Faster hipot testing with enhanced safety19 May 2011 - The new Vitrek 950i Series of hipot (high-potential) testers incorporates advanced DSP technology to enhance the speed of testing as well as adding a number of new capabilities. The 950i Series combines high output power with up to 50 mA of current sourcing for AC and DC hipot testing. Strategy for 3D-IC Design, Verification and Testing18 May 2011 - Mentor Graphics Corporation described its strategy for meeting the EDA requirements of designing, verifying, manufacturing and testing integrated circuit products using multi-die vertical stacking technology, popularly referred to as “3D-IC.” It also announced its 3D-IC testing solution employing multiple components of the Tessent design-for-test product line for integrated multi-die hierarchical scan and built-in self-test (BIST) methodologies. More Articles ...
Related Articles: |
Upcoming Events More events...
Tag CloudOscilloscope
JTAG
Boundary Scan
Goepel
PXI
Rohde & Schwarz
Tektronix
Keysight
AOI
Anritsu
National Instruments
Inspection
Teledyne LeCroy
Aeroflex
LTE
Yokogawa
AXI
Spectrum Analyzer
Keithley
In-Circuit-Test
Signal Analyzer
Automotive
EMC-Test
Signal Generator
Advantest
Multitest
B&K Precision
Corelis
Power Supply
SPI
Flying Prober
Teseq
Cognex
Switching
Teradyne
Viscom
Pickering
Fluke
GAO Tek
PCIe
|
||
© All about Test 2018 |