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Readers Top 5 News of last 30 days
Latest Test and Measurement NewsDisplayPort 1.2 Source Compliance and Validation Software23 May 2011 – Agilent Technologies announced the industry’s first DisplayPort 1.2 source compliance and validation software. The software runs on Agilent’s industry-leading Infiniium oscilloscopes and provides the complete compliance test suite for the extensive physical-layer tests required for DisplayPort 1.2 source devices. Multifunctional Boundary Scan Controller23 May 2011 - GOEPEL electronic introduced SFX/COMBO1149-(x), the first desktop compact controller within the framework of the Boundary Scan hardware platform SCANFLEX. The multifunctional controller enables the combination of numerous strategies for testing, programming as well as design validation, and is ready to support new and upcoming standards such as IEEE 1149.7 and chip embedded instrumentation (IEEE P1687). Highest scalability and future reliability are ensured by the integrated hardware extension slots. Test Handler upgradeable from Engineering to High-Volume20 May 2011 - Multitest announced the new MT2168 test handler. Due to its scalable design the base unit configuration can be adjusted to the actual requirements – not only at the initial installation, but also later, e.g. if the MT2168 is moved from engineering to a high-volume site. Faster hipot testing with enhanced safety19 May 2011 - The new Vitrek 950i Series of hipot (high-potential) testers incorporates advanced DSP technology to enhance the speed of testing as well as adding a number of new capabilities. The 950i Series combines high output power with up to 50 mA of current sourcing for AC and DC hipot testing. Strategy for 3D-IC Design, Verification and Testing18 May 2011 - Mentor Graphics Corporation described its strategy for meeting the EDA requirements of designing, verifying, manufacturing and testing integrated circuit products using multi-die vertical stacking technology, popularly referred to as “3D-IC.” It also announced its 3D-IC testing solution employing multiple components of the Tessent design-for-test product line for integrated multi-die hierarchical scan and built-in self-test (BIST) methodologies. Anritsu appoints new Partner for the Russian Federation17 May 2011 - Anritsu announced the appointment of ELVIRA Production Co. Ltd. as its certified service partner in Russia. This certification means that ELVIRA will be providing OEM backed calibration and repair services on Anritsu products. Anritsu will be directly supporting ELVIRA, as an integral part of this relationship to ensure high quality service support of Anritsu products for their Russian customers. Fast and precise 3-D Paste Inspection16 May 2011 – When it comes to inspecting electronic assemblies, detecting defects in the early stages with a solder paste inspection is highly important. In order to make 3-D paste inspection even faster and more efficient, Viscom has equipped its high performance AOI system S3088 with the proven sensor technology from CyberOptics. This 3-D SPI sensor technology inspects the solder paste deposit with highest speed and precision. The first system with this sensor, the Viscom S3088 SPI, was be presented at the SMT in Nuremburg. More Articles ...
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