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Readers Top 5 News of last 30 days
News - Board and System TestNew Method to measure Group Delay over long Distances19 April 2011 — Rohde & Schwarz has developed a unique method that accurately measures group delay and phase linearity on satellite links. With the new R&S ZVA-K10 software option, users can perform measurements using two network analyzers located at separate sites. In open-area tests, for example, the analyzers can bridge long distances between a transmitter and a receiver. Test Equipment for Sub-Assemblies of Electric Vehicles14 April 2011 - IPTE Factory Automation (FA) announces a test system for the battery charger block (BCB), a sub-assembly needed for the management of the charging procedure and the functional control of the storage-battery pack in electric vehicles (EV). The test system was developed in cooperation with a customer. Teradyne and JTAG Technologies announce Boundary Scan Product Collaboration14. April 2011 - Teradyne, Inc. announced an agreement with JTAG Technologies to sell and distribute their Symphony/TS boundary scan product. The solution, designed specifically for Teradyne by JTAG Technologies, provides an advanced boundary scan test option for manufacturers using Teradyne's popular TestStationT and legacy GR228X family of In-Circuit Test systems. Corelis releases new Version of Boundary-Scan Tool Suite13 April 2011 – Corelis, Inc announced the availability of the latest version of its ScanExpress Boundary-Scan Tool Suite. The new Version 7.5 CD accelerates IEEE-1149.6 test development with new automation features. ScanExpress TPG now includes automatic identification and classification of resistors and capacitors involved in IEEE-1149.6 high speed, AC-coupled, and differential circuits. Two Power Sources in One Unit for EMC Tests12 April 2011 - Teseq has released the VAR 3005, a dual voltage supply source controlled by Teseq's NSG 3000 series of EMC test generators. This new supply source not only regulates test voltage, but also generates the reduced voltage for dips and drops testing of EUTs (Equipment Under Test). Combination of Boundary Scan Test and analogue Opens/Shorts Test12 April 2011 - GOEPEL electronic introduced the TIC02/PMU, another TAP Interface Card (TIC) within the frame of the technologically leading JTAG/Boundary Scan hardware platform SCANFLEX. The new module enables the test of peripheral networks in particular for shorts and open connections without powering up the UUT. Using this option, dangerous solder faults can be detected before possibly leading to latent or permanent damages of the integrated circuit when operation voltage is switched on. New Modular Functional Test System for Automotive Electronics07 April 2011 – Agilent Technologies introduced the Agilent TS-8900 Automotive Functional Test System – an off-the-shelf, standardized PXI-based solution that offers unsurpassed test coverage and speed for use in automotive electronics test applications. It is especially suited for testing medium- to high-pin-count electronic control units. More Articles ...
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