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Mirtec-MV-3_SeriesSMT/Hybrid/Packaging 2012:
MIRTEC to exhibit Innovative AOI and SPI Systems

04 May 2012 – MIRTEC will showcase its award-winning MV-9 3D Series AOI System alongside a range of other AOI and SPI technologies at its distributor pb tec’s Booth 7:506B during SMT Nuremberg, scheduled to take place May 8-10, 2012 at the Messezentrum in Nuremberg, Germany.

“We at MIRTEC are very excited to present our award-winning MV-9 2D/3D In-Line AOI Machine at our German distributor pb tec’s booth during SMT Nuremberg 2012,” stated David Bennett, President of MIRTEC Europe. “This technologically advanced system combines MIRTEC’s exclusive 15 Mega Pixel 2D ISIS Vision System with our revolutionary 3D Multi-Frequency Quad Moiré Technology, providing an unsurpassed level of inspection capability to the electronics manufacturing industry.” Fully configured, the new MIRTEC MV-9 machine at SMT Nuremberg 2012 will also feature four 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera.

Also on display will be MIRTEC’s MS-11 In-Line SPI System which uses Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste deposition on PCBs post screen print. The MS-11 inspects for; insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. New to Europe at SMT/Hybrid/Packaging 2012, the MS-11 will be configured with the 15M pixel ISIS Vision System for enhanced image quality, superior accuracy and lightning-fast inspection rates. The MS-11 uses the same robust platform as MIRTEC’s MV-9 Series. Inspection heads are interchangeable between the two systems, adding ultimate flexibility to the inspection process.

Mirtec will also highlight its MV-3 Series Desktop System, the industry’s most widely accepted Five Camera Desktop AOI System. The MV-3 Series features the Intelli-Beam Laser System and is configured with a Top-Down View, Ten Mega Pixel camera. The system also features Precision 9.8 Micron Telecentric Compound Lens and four Ten Mega Pixel Side-View Cameras with a Remote Debugging Function for perfect re-inspection by the operator with 360° images from side on defect.

www.mirtec.com


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SMT Hybrid Packaging 2014
Nuremberg (Germany)
06 to 08 May 2014
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Nuremberg (Germany)
20 to 22 May 2014
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