SMT/Hybrid/Packaging 2012:
Solderability Tester and Ultrasonic Inspection Tool

07 May 2012 – MICROTRONIC will showcase its LBT-210 Solderability Tester and the Sonix ECHO, a universal inspection tool for production, failure analysis and development in Hall 9, Booth 304A at the upcoming SMT/Hybrid/Packaging show, scheduled to take place May 8-10, 2012 in Nuremberg, Germany.

Microtronic’s LBT-210 automatic and PC-controlled solderability tester is a revolutionary system that meets today’s current industry challenges. The system is operated by using solder paste and a temperature profile.  A component is placed on printed solder paste and heated through the same temperature profile that is used in production. All force parameters and values during the heating cycle are monitored and saved. This is the only known existing method of simulating and qualifying the solder profile of an in-line production solder furnace in conjunction with different solder pastes and components.

Microtronic will also highlight the Sonix ECHO, a universal inspection tool for production, failure analysis and development. This non-destructive, ultrasonic testing equipment is designed to increase yield, simplify testing and improve productivity and throughput, both on the production floor and in the lab. The Sonix ECHOTM can detect defects as small as 0.05 micron and is an ideal tool for bump detection, stacked die (3D Packaging) inspection, complex flip chip inspection and more traditional plastic packages.