2D X-Ray Inspection within any Plane of a complete PCB

07 December 2011 - Nordson DAGE announced with X-Plane a revolutionary option for their range of X-ray inspection systems. The new option uses a proprietary, patent applied for, tomosynthesis, or CT technique to create 2D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board.

In this way, the superior image quality of the Nordson DAGE X-ray systems can now be extended into separating individual layers at a level of excellence that the traditional laminography technique cannot achieve.

Dr. David Bernard, Nordson DAGE Product Manager - X-ray Systems said “Standard 2D X-ray views of today’s double-sided PCBs can be difficult to interpret and analyze, as the joints from both sides of the board, and within multi-layer devices, such as the package on package, can overlap in the image. To combat these limitations, the X-Plane option uses the standard Nordson DAGE X-ray systems to simply and easily separate all these different layers, as well as producing slices in any other planar view.  But most importantly, X-Plane can do all this over an 18” x 16” inspection area and without needing to cut the board.”