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Readers Top 5 News of last 30 days
News - Component TestHigh-Speed Testing of SoCs with Serial, Parallel or Memory Interfaces11 December 2012 - Advantest introduced its new T2000 8-Gbps Digital Module to address the test requirements of system-on-chip (SoC) devices with high-speed serial, parallel and memory interfaces such as PCI-Express and double data rate (DDR) connections. The T2000 8GDM has the versatility to test a wide range of SoC interfaces while operating at data rates up to 8 Gbps. Key capabilities include clock and data recovery (CDR), jitter injection, I/O dead band cancellation and multi-strobe operation. Wafer Inspection Tool for LED and Adjacent Markets10 December 2012 - KLA-Tencor Corporation announced its next-generation light-emitting diode (LED) patterned wafer inspection tool, the ICOS WI-2280. Designed specifically for defect inspection and 2D metrology for LED applications, the ICOS WI-2280 also provides enhanced inspection capabilities and increased flexibility for microelectromechanical systems (MEMS) and semiconductor wafers spanning two inches to eight inches in size. High-Speed Test for CMOS Image Sensing Devices03 December 2012 - Advantest Corporation has introduced the IC industry’s fastest image-capture module to cost-efficiently test the high-frequency, low-power D-PHY and M-PHY interface chips. The new T2000 3Gbps CMOS Image Capture Module operates on Advantest’s T2000 ISS system, an industry-leading test platform for a broad range of system-on-chip (SoC) devices. Wafer MVM-SEM Tool supports Next-Generation Devices26 November 2012 - Advantest has introduced its new Multi-Vision Metrology Scanning Electron Microscope, the Wafer MVM-SEM E3310, which measures fine-pitch patterns on a wide range of wafer types with unparalleled accuracy, utilizing Advantest’s proprietary electron beam scanning technology. Built on advances in the technology used in Advantest’s E3630 MVM-SEM for photomasks, the E3310 achieves superior capabilities for scanning and measurement of wafers for next-generation devices. Mask Defect Review SEM for Next-Generation Photomasks20 November 2012 - Advantest Corporation developed a new mask defect review tool, the Mask DR-SEM E5610, for reviewing and classifying ultra-small defects in photomask blanks. The E5610 inherits the highly stable, fully automatic image capture technology developed by Advantest for its acclaimed multi vision metrology SEM for photomasks, and features a newly developed beam tilt mechanism that enables scanning at oblique angles. Tektronix revolutionizes ASIC Prototyping16 November 2012 - Tektronix introduced version 2.0 of its Certus ASIC prototyping debug solution. A suite of software and RTL-based embedded instruments, Certus 2.0 fundamentally changes the ASIC prototyping flow by enabling full RTL-level visibility and making FPGA internal visibility a feature of the prototyping platform. This simulation-level visibility allows engineers to diagnose multiple defects in a day versus a week or more with existing tools. Combination of Curve Tracer and Parameter Analyzer23 October 2012 – Keithley Instruments introduced seven instrumentation, software, and test fixture configurations for parametric curve tracing applications for characterizing high power devices at up to 3,000V and 100A. They’re optimized for characterizing the growing number of high power semiconductor devices, including those based on silicon carbide (SiC) and gallium nitride (GaN) technology. More Articles ...
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