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Readers Top 5 News of last 30 days
News - Component TestPick-and-Place Test Handler with full Device Traceability15 August 2012 - Multitest now offers its pick-and-place test handler MT2168 with optional 2D code reader to ensure 100 percent device traceability and lot integrity. The 2D code reader identifies each single package. The package ID can then be used to verify the data with the lot information that has been provided to the handler by manual HMI input or via a scanned bar code. Comprehensive DDR4 Compliance Test Application09 August 2012 – Agilent Technologies introduced the industry’s first compliance test application for systems using double-data-rate 4 memory. The Agilent N6462A DDR4 test application helps memory design engineers accelerate turn-on and debug of DDR4 systems by automating the execution of physical layer tests, including the new data jitter measurements on Agilent Infiniium 9000, 90000A, 90000 X- and 90000 Q-Series oscilloscopes. High Performance Test Solution for Power Applications30 July 2012 - The Multitest MT9928 gravity handler ideally supports the special features of the recently launched ecoAmp Kelvin contactor. Field proven temperature performance and highest positioning accuracy ensure cost-efficient and reliable tri-temp testing as well as highest test yield. The MT9928 features leading thermal performance across the entire range from -55° C to + 155° C with a temperature accuracy of +/- 2.0°C and stability of +/- 0.5°C. Defect Inspection Tool for 450mm Wafers24 July 2012 - KLA-Tencor Corporation announced the installation of its first process control systems capable of handling and inspecting 450mm wafers: a new configuration of the market-leading Surfscan SP3 platform called the Surfscan SP3 450. Fully automated, these unpatterned wafer inspection systems are designed to meet the demanding defect and surface quality characterization requirements of the 20nm node and beyond, enabling control of the manufacturing process for 450mm polished silicon and epitaxial silicon substrates. Wafer Inspection System for Sub-20nm Era18 July 2012 - Applied Materials unveiled its Applied UVision 5 wafer inspection system for detecting defects in the critical patterning layers of logic devices at the sub-20nm node. The system's deep ultra-violet (DUV) laser and simultaneous brightfield and greyfield light collection capabilities deliver up to double the light intensity to the wafer over previous tools, enabling the UVision 5 system to capture up to twice the number of killer defects. This unmatched sensitivity allows semiconductor manufacturers to achieve more stable and robust control over the fabrication of their smallest circuit features. Teradyne increases J750 Platform Throughput and Test Coverage17 July 2012 - Teradyne announces the availability of the High Density Device Power Supply (HD DPS) instrument for the J750 and IP750 test platforms. The HD DPS instrument enables semiconductor companies to increase site count and DC measurement throughput resulting in lower cost of test for thousands of consumer digital devices including microcontroller, image sensor and standard logic devices. Teradyne has received multiple orders from multiple customers for the new HD DPS instrument and begun product shipments. 3-in-1 Semiconductor Test Clock Module for testing High-Speed ICs13 July 2012 - Advantest Corporation announced the new T2000 LJC16 16-channel, low-jitter-clock module. The LJC16 module combines different digital clock and analog clock/sine-wave requirements in a single high-multi-site system. By using the new LJC16 module all necessary tests can be performed on one tool without needing multiple modules. More Articles ...
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