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Latest Test and Measurement NewsFar-field Analysis of infrared Sources
Double-sided 3D Inspection of THT Assemblies
PCI Express 5.0 OCP NIC 3.0 Interposer
Simplified Verification and Debugging of CAN XL and other Automotive Protocols
Battery Analyzer supporting EIS Technology
Precise Verification of Power Losses in Transformers
Flexible DUT Interface offers increased Parallelism23 June 2022 – Advantest launched its DUT Scale Duo interface for the V93000 EXA Scale SoC test systems, enabling the industry’s highest level of parallelism for testing advanced semiconductors. With this revolutionary interface, the usable space on DUT boards and probe cards is increased by 50 percent or more while wafer probe and final-test set ups can accommodate component heights that are more than three times taller. More Articles ...
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01 July 2022 – The infrared camera VTC 2400 from Instrument Systems was developed specifically for the far-field analysis of IR emitters and designed for use in both the lab and production environment. It is recommended for the analysis of VCSEL applications, such as 3D-sensing in smartphones or LiDAR systems in the automotive industry. The cost-effective system consists of a light-permeable, diffusely scattering screen and a monochrome camera specially designed for measurements in the near infrared range.
30 June 2022 - GOEPEL electronic enhanced its system THT Line · 3D, an AOI for double-sided, parallel inspection in electronics production. The system now features an increased inspection depth and inspection reliability. The THT Line · 3D can now also inspect both the top and bottom of the assembly simultaneously in 3D. An additional 3D AOI module in the system makes this possible. As a result, it is possible, for example, to inspect selective solder joints on both sides of the assembly at the same time and to measure the solder volume and the pin length with the 3D method.
29 June 2022 – Teledyne LeCroy announced availability of a PCI Express 5.0 Open Compute Project (OCP) Network Interface Card (NIC) 3.0 interposer that works in combination with Teledyne LeCroy’s Summit family of PCI Express 5.0 protocol analyzers. The new OCP interposer allows engineers to test product designs that incorporate OCP NIC 3.0 with PCIe 5.0, NVM Express (NVMe) or Compute Express Link (CXL) technologies. The PCIe 5.0 OCP interposer joins the list of CrossSync PHY enabled interposers, allowing users to debug enhanced power management and link training equalization through correlated and time aligned physical and protocol layer views.
28 June 2022 - Keysight Technologies released an oscilloscope-based automotive protocol trigger/decode solution (D9010AUTP) covering CAN XL (Controller Area Network eXtra Long) that enables engineers to verify and debug low-speed automotive serial bus protocols and simplify the development and troubleshooting of systems including CAN/CAN FD (Flexible Data Rate) and CAN XL.
27 June 2022 - B&K Precision announced the newest addition to their battery analyzer product line with the model BA8100. This instrument is capable of accurately measuring the internal impedance of a battery at a user-defined frequency. Additional measurements include voltage, current, phase, capacitance, inductance, and quality factor.
24 June 2022 - Yokogawa launched the WT5000 Precision Power Analyzer - Transformer Version, which is dedicated to helping transformer manufacturers develop and validate the losses of highly efficient products for utility industry customers. Transformers play a crucial role in the power grid. With electricity demand set to soar to as much as 40 TWh by 2040 and with transformers responsible for some 4% of distribution network losses, achieving more efficient transformers has never been more important.