|News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation.|
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Latest Test and Measurement News
New Wiring Validation Software makes testing faster, easier
04 December 2013 – CableTest Systems announced the launch of its newest software product, ‘MPT Studio’, a powerful user and programmer environment for its market leading ‘MPT’ line of multi-function electrical wiring analyzers. MPT Studio makes it easier for first time users of automated test equipment to perform complex testing of cables, connectors, and wiring systems with menu-based test programming, new high speed test functions and visual aids for product troubleshooting.
Interruption-free Power Supply for mobile DAQ Systems
04 December 2013 – IPETRONIK presents a new advanced version of intelligent interruption-free power supply module. M-UPS2 serves as reliable power buffer for car testing DAQ systems. Voltage drops and breakdowns, e.g. at startup and cold start testing, are bridged safely. This power supply module guarantees reliable and consistent data acquisition - even under extreme environmental conditions such as during summer and winter testing.
Tektronix enhances Spectrum Analyzer Performance of Mixed Domain Oscilloscopes
03 December 2013 – Tektronix introduced the MDO4000B series of mixed domain oscilloscopes that features significantly enhanced spectrum analyzer performance and, when used with Tektronix SignalVu-PC, the industry’s widest bandwidth vector signal analysis capability and deep support for WLAN 802.11 a/b/g/j/n/p/ac testing.
Corelis adds advanced Triggering to I2C Bus Analyzers
02 December 2013 – Corelis has released a new version of its I2C Exerciser software, Version 1.24. The software enhances the triggering capability of Corelis’ powerful BusPro-I and CAS-1000-I2C/E bus analyzer products. The I2C Exerciser software allows users to generate I2C traffic, non-intrusively monitor and record all I2C bus traffic, and display real-time data in both state and waveform timing windows—all concurrently using a single instrument.
Innovative Wafer Inspection combining 2D and 3D Measurements
02 December 2013 - Since the density and complexity of wafer structures increase every year, the industry needs high-performing and reliable systems for quality control. Against this background, ISRA VISION introduces a product line offering an innovative technological approach for non-contact optical wafer inspection. As required, different 2D and 3D gauging procedures may be combined into one inspection system measuring structure sizes of down to 1 micrometer in under one minute.
Agilent Oscilloscope JTAG Boundary Scan Tektronix Goepel PXI AOI Anritsu LTE National Instruments Advantest Keithley Inspection Automotive Aeroflex LeCroy spectrum analyzer EMC signal Generator signal analyzer AXI Yokogawa Power supply Multitest TESEQ Handheld calibration USB SPI Switching Viscom Corelis ASSET InterTech characterization probe Pico Technology GAO Tek
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