|News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation.|
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Latest Test and Measurement News
High-Volume Testing of Ultra-Fast SerDes Applications
04 April 2014 - Advantest Corporation introduced its newest digital channel card, the Pin Scale Serial Link (PSSL) card, for at-speed characterization and volume production of today’s high-speed semiconductors. PSSL is the fastest fully integrated automated test equipment (ATE) instrument on the market, capable of data rates up to 16 Gbps.
Ethernet Interface Verification with an Oscilloscope
04 April 2014 -The R&S RTO digital oscilloscope family of Rohde & Schwarz now features an automated compliance test solution for Ethernet interfaces. The new R&S RTO-K22 and R&S RTO-K23 Ethernet compliance options allow users to perform standard-compliant automated tests on 10/100/1000BASE-T and 10GBASE-T Ethernet interfaces. All compliance tests meet IEEE and ANSI Ethernet test specifications.
SEMI expects 2014 Fab Equipment Spending to Increase 20-30 Percent
03 April 2014 - The latest release of the SEMI World Fab Forecast reveals a 20 to 30 percent projected increase in fab equipment spending in 2014. The uptick to 30 percent depends on specific fab projects in the Europe/Mideast and Asia regions, as detailed in the report. For 2014, the report identified over 190 fab projects spending on construction and/or equipment and over such 250 projects in 2015 (including Discretes, LED, Analog and Logic fabs).
Digital Oscilloscope with optional Arbitrary Function Generator
03 April 2014 - RIGOL Technologies EU GmbH introduces the DS2000A-(S) series digital oscilloscope with a bandwidth from 70MHz to 300MHz. The specially designed analog front end delivers a lower noise floor and a wider vertical range (500 uV/div to 10 V/div) at full bandwidth.
CAMTEK announces Semiconductor Inspection and Metrology Platform
02 April 2014 – Camtek started the customer evaluation of its next generation Semiconductor Inspection and Metrology platform designed for the Advanced Packaging market. The new systems deliver unparalleled 2D and 3D inspection and metrology capabilities for wafers, both before and after testing, along the bumping process or after dicing.
Tektronix enhances Entry Level Oscilloscopes
02 April 2014 – Tektronix introduced the TBS1000B-EDU and TBS1000B series of 2-channel oscilloscopes. Featuring across-the-board enhancements such as a high-resolution 7-inch display, dual channel frequency counter and 34 automated measurements, the new instruments represent the best value entry level oscilloscopes for students and teachers and support a wide range of general commercial applications including basic research and development.
Inline PCB Inspection System with 3D Capability
01 April 2014 - Nordson YESTECH launched its new FX-940 AOI Inline PCB inspection system , an automated solution for the inspection of solder defects, lead defects/lifted leads, component presence and position, correct part/polarity, through-hole parts, and co-planarity of chips, BGAs and other height-sensitive devices.
Agilent Oscilloscope JTAG Tektronix Boundary Scan Goepel PXI LTE AOI Anritsu National Instruments Advantest Aeroflex Inspection Automotive Keithley EMC spectrum analyzer LeCroy signal Generator signal analyzer AXI Yokogawa Power supply Multitest Handheld TESEQ calibration SPI Switching USB Semiconductor Test wireless Pico Technology ASSET InterTech characterization Viscom Corelis
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