|News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation.|
Readers Top 5 News of last 30 days
Latest Test and Measurement News
Inline AXOI system communicates with ASYS OIC Software
30 March 2015 - The high-end 3D X-ray inspection system X-Line 3D from GOEPEL electronics now features a link to the OIC System (Overall Inline Communication) of ASYS Automatisierungssysteme. The OIC system visualizes the electronics production line and displays status, product and production process in real time. In parallel, all relevant production relevant data and availabilities are truthfully documented.
Flying Probe Tester for Substrates down to 10 µm
30 March 2015 - atg Luther & Maelzer introduced a flying probe system for substrate test. The first system was deliverd to a major customer in Korea. The S3 10µm Substrate Tester is the first system of a new atg Luther & Maelzer product line. It meets the challenging requirements of high end substrate test such as positioning accuracy and high number of contact points by applying the advanced flying probe technology of atg Luther & Maelzer.
Compact, autonomous Scanner simplifies mobile Network Optimization
27 March 2015 - The new R&S TSMA mobile network scanner from Rohde & Schwarz can execute drive tests without an external PC. The compact 1200-gram scanner makes it easier to collect in-the-field measurement data required for mobile network optimization. It supports all current and future wireless standards in all bands and achieves very high measurement rates.
Digital Stimulus/Response Module for RF Chipset Test Systems
27 March 2015 – Keysight Technologies introduced a high-speed, 16-channel PXIe digital stimulus/response module with a parametric measurement unit (PMU). The module provides fast and flexible RF chipset test emulation and device characterization for test engineers in design validation and production test.
Multitest introduces Link Contactors with vertical Probes for IC Test
26 March 2015 - Multitest has launched the new Link Contactor product line for analog, mixed signal, and RF applications. The innovative vertical probe design combines advantageous mechanical features - such as self-cleaning and scrub - with superior electrical performance and an architecture that eliminates wear on test interface board pads. The Link contactor is based on the technology developed by Titan Semiconductor Tools acquired by Xcerra Corporation in February.
PXI Switching Solutions for up to 16 Amps
26 March 2015 - Pickering Interfaces is expanding its range of 16 Amp PXI switching solutions. Following the success of the 16 Amp uncommitted relay modules (model 40-161), the company is introducing two new 16 Amp PXI module families: a PXI power multiplexer (model 40-662) and a PXI power matrix (model 40-552) both available in several versions.
5G millimeter-wave Channel Sounding Test Solution
25 March 2015 - Rohde & Schwarz and Fraunhofer Heinrich Hertz Institute (HHI) developed novel 5G channel sounding solution. The solution comprises the R&S SMW200A vector signal generator and the R&S FSW signal and spectrum analyzer in combination with a synchronization unit and application software from Fraunhofer HHI. The test solution supports the research activities aimed at exploiting the microwave and millimeter-wave spectrum within 5G networks.
Agilent Oscilloscope JTAG Tektronix Goepel Boundary Scan LTE PXI AOI Anritsu National Instruments Automotive Advantest Aeroflex Inspection Keithley EMC spectrum analyzer signal Generator Keysight signal analyzer Power supply AXI LeCroy Yokogawa Multitest Handheld calibration Teledyne LeCroy Switching TESEQ Semiconductor Test USB characterization network analyzer wireless Semiconductor probe
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