17 April 2026 – Hioki E.E. Corporation launched the AC/DC Current Probe CT6847A, a clamp-on current sensor designed for power measurement applications. Developed to meet the growing demand for large-current measurement in certification testing of electric trucks and other large electric commercial vehicles, the CT6847A expands Hioki’s lineup of high-accuracy current sensing solutions for next-generation mobility and high-power applications.
16 April 2026 — Teledyne LeCroy announced the Frontline X700 Wireless Protocol Analyzer, its most advanced wireless analysis system to date. Designed for the next era of Bluetooth innovation, the Frontline X700 delivers unprecedented visibility into Bluetooth operation in emerging higher‑frequency bands and simultaneously extends Wi‑Fi 7 Multi‑Link Operation (MLO) analysis across three bands, a capability critical for modern coexistence testing.
Read more: Bluetooth Protocol Analysis with 880 MHz of Concurrent Capture
15 April 2026 - Keysight Technologies introduced new 224G test solutions that expand its 1.6T end-to-end portfolio, addressing the growing R&D validation and manufacturing challenges of next-generation electrical and optical interconnects for AI data centers. As AI workloads drive unprecedented scale-up and scale-out architectures, data center networks are rapidly transitioning to 224G electrical lanes and 1.6T optical modules. These advances introduce significant challenges across the development lifecycle, including signal integrity at extreme data rates, tighter compliance margins, and the need for efficient, repeatable testing in high-volume manufacturing.
Read more: 224G Test Solutions targeting 1.6T Optical Network Validation
14 April 2026 - Saelig Company introduced the Aim-TTi ADM1055 DMM, a next‑generation 5½‑digit bench multimeter engineered to deliver the measurement accuracy, flexible functionality, and seamless integration needed for development labs, production test environments, and educational establishments. The ADM1055 provides 0.02% basic DC accuracy, the precision needed for tasks such as device characterization, troubleshooting and teaching. Measurement sensitivity is specified to 1uV, 1 mohm, 10 nA, 0.01Hz, and 100pF.
Read more: 5½‑digit Bench Multimeter with full-color Touchscreen Interface
13 April 2026 - Teradyne announced the launch of the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing. As demand for high-speed, energy-efficient optical interconnects surges, driven by AI and next-generation data centers, manufacturers face challenges in scaling SiPh and CPO to high volume manufacturing. By integrating industry-leading optical and electrical instrumentation with Teradyne’s proven UltraFLEXplus platform, Teradyne Photon 100 enables high-throughput, automated testing across all key manufacturing stages, including wafer, optical engine, and co-packaged module insertions.
Read more: Test Platform for Silicon Photonics and Co-Packaged Optics
10 April 2026 - Viasat and Rohde & Schwarz have joined forces to boost testing for Narrowband Non-terrestrial Networks (NB-NTN) IoT devices connecting via satellite. By thoroughly validating devices and confirming interoperability with Viasat’s network, the collaboration aims to help ensure uninterrupted connectivity for a wide range of satellite-based Internet of Things (IoT) applications.
09 April 2026 - ANRITSU CORPORATION has signed a sales agreement with Thurlby Thandar Instruments Limited (TTi), a UK based test and measurement instrument manufacturer. Under this agreement, Anritsu has started selling TTi general purpose test instruments in European markets as of 1 April 2026, expanding its portfolio beyond communications test and measurement into core laboratory and production instrumentation. As electronic systems continue to diversify in complexity and application, engineers require reliable, high‑performance measurement instruments that can be deployed consistently across R&D, production, maintenance, and education environments.
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