17 December 2024 – Saki Corporation launched the 3Xi-M200v3, the latest addition to its acclaimed 3Xi-M200 AXI series. This advanced X-ray automated inspection system is designed to ensure the highest manufacturing quality of increasingly compact and slim power modules. The 3XI-M200v3 delivers high-speed and high-precision inspections of power modules equipped with heat sinks. Featuring a large X-ray camera and optimized image processing algorithms, the 3Xi-M200v3 achieves three times the resolution of its predecessors while reducing inspection times by up to 50%.
Read more: High-Resolution X-Ray Inspection Solution for Power Modules
12 December 2024 - GÖPEL electronic's integration packages offer a powerful combination of hardware and software for seamless integration in Automatic Test Equipment (ATE). JTAG/Boundary-Scan integration increases test coverage, improves diagnostics, and enhances process optimization and failure analysis. The latest integration of embedded JTAG solutions for the SPEA 3030 DualCore in-circuit tester (ICT) is aimed specifically at high-volume manufacturing test and supports parallel processing of multiple units under test (UUT). The goal is to significantly reduce cycle times while increasing test coverage and to ensure maximum efficiency of the test process.
Read more: Efficient Combination of In-Circuit and Boundary Scan Test
05 December 2024 - Yamaha Robotics SMT section presented innovations in high-speed surface-mount inspection at electronica 2024, demonstrating the latest AI skills and special features for applications including LED lighting, e-mobility, and mechatronics. Yamaha’s YRi-V 2D/3D automatic optical inspection (AOI) systems now come with special features that simplify checking the alignment and spacing of components such as LED arrays and position detectors. These help cut the setup time for inspecting densely populated automotive and architectural lighting assemblies, as well as electric drives and mechatronics that contain Hall sensors for brushless motor control.
28 November 2024 – XJTAG, a global provider of electronic testing and programming solutions for prototyping and manufacture, showed a preview at Electronica 2024 of its latest hardware product, the XJLink-PF40 JTAG controller, due for release in 2025. The XJLink-PF40 is designed to handle the challenges of complex, high-density circuit boards, making it an ideal tool for PCB engineers from prototype debug to manufacturing test. With up to eight JTAG TAPs over 40 I/O pins, the XJLink-PF40 enables multiple test access points to one unit under test (UUT), expanding test coverage for the most demanding applications.
27 November 2024 - Rohde & Schwarz and ETS-Lindgren continue their long‑standing partnership to deliver comprehensive over‑the‑air (OTA) testing solutions for next‑generation wireless technologies. ETS-Lindgren has integrated the CMX500 one‑box signaling tester and R&S SMBV100B vector signal generator from Rohde & Schwarz into its EMQuest software. This collaboration supports the latest standards, including 5G FR1, 5G FR2, Wi‑Fi 7 and A-GNSS.
Read more: OTA Testing Solutions for next‑gen wireless Technologies