News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation.
02 July 2025 - ESPEC has launched a new thermal cycle chamber capable of delivering a controlled specimen temperature ramp rate of 20K/min, developed to meet the increasing demands of international standards for semiconductor and electronics reliability testing. The TCC-151W-20, is available in the UK through exclusive distributor Unitemp.
19 June 2025 - Chroma introduced a battery reliability test system integrated with EIS (Electrochemical Impedance Spectroscopy) functionality, enabling automated switching between DC charge/discharge and AC impedance measurements. This innovation eliminates the need for separate EIS testing stations: battery connections are made once with no need for repeated handling or rewiring, which significantly reduces labor demands and operational errors. A single EIS tester can support up to 72 channels, with flexible test programming that allows impedance measurements and data logging to be performed simultaneously during DC testing.
20 May 2025 – Advantest unveiled SiConic Test Engineering (TE), the newest addition to the SiConic family introduced in February 2025. SiConic TE offers test engineers the ability to bring up and validate structural and functional tests over high-speed I/O (HSIO) interfaces in a scalable bench environment, enabling earlier validation and debug without occupying valuable ATE systems. SiConic Link flexibly connects to standard evaluation boards through functional interfaces like USB, PCIe, control interfaces, and GPIOs. This is the foundation for SiConic TE to enable test engineers to rapidly validate and debug design verification (DV) and design for test (DFT) content in SiConic’s unified environment on the bench.
Read more: Unified, scalable Bench Environment for Debug and Validation
23 April 2025 - Keysight Technologies announces the launch of the Next-Generation Embedded Security Testbench, a consolidated and scalable test solution designed to address the increasing complex security testing demands of modern chips and embedded devices. This new solution offers enhanced flexibility, reduces test setup complexities, and improves the reliability and repeatability of critical security evaluations.
08 April 2025 - Teradyne has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce the availability of the first high-volume, double-sided wafer probe test cell for silicon photonics. This innovative solution is designed to meet the growing demand for high-throughput electro-optical testing of silicon photonic wafers driven by co-packaged optics (CPO) applications.
Read more: Double-Sided Wafer Probe Tester for Silicon Photonics
