News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation.
24 September 2024 – Teledyne DALSA introduced the Linea HS2 TDI line scan camera family. Designed for ultra-high-speed imaging in light starved conditions, it delivers exceptional image quality with 16k/5 µm resolution and boasts an industry leading maximum line rate of 1 Megahertz, or 16 Gigapixels per second data throughput. The Linea HS2 features a highly sensitive Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor with 16k/5 µm resolution and optimized Quantum Efficiency, meeting the rigorous demands of current and future machine vision applications.
03 September 2024 - Keysight Technologies introduces the Electrical Structural Tester (EST), a wire bond inspection solution for semiconductor manufacturing that ensures the integrity and reliability of electronic components. The semiconductor industry is faced with testing challenges due to the increasing density of chips in mission-critical applications such as medical devices and automotive systems. Current testing methodologies often fall short in detecting wire bond structural defects, which lead to costly latent failures. In addition, traditional testing approaches frequently rely on sampling techniques that do not adequately identify wire bond structural defects.
Read more: Wire Bond Inspection Solution for Semiconductor Manufacturing
21 August 2024 – Advantest celebrates the 25th anniversary of its flagship V93000 system-on-chip (SoC) test platform. The V93000 revolutionized the semiconductor test industry with its single scalable platform approach, enabled by its test processor-per-pin architecture, which has endured over four generations. As a testament to this endurance, the very first V93000 system installed is still in use at the customer site in Italy, alongside several recently purchased fourth-generation V93000 EXA Scale testers.
Read more: SoC Tester Platform - continually enhanced and expanded over 25 Years
19 August 2024 - In the fiercely competitive consumer electronics market, high-end audio products like wireless headphones, TWS earbuds, multi-channel gaming headsets, and wireless speakers are powerful drivers of innovation and growth. As competition heats up in the mid to low-end segments, manufacturers are packing their products with advanced features. High-bitrate codecs, low power consumption, smart charging, smart noise cancellation, multi-microphone calling, health tracking - everything to stand out and stay competitive.
06 August 2024 - Test Research, Inc. (TRI) will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 4F from September 4 - 6, 2024 and will be exhibiting the new Wafer Inspection Platform, TR7950Q SII, featuring a 25MP camera with 2.5 μm resolution and a 12MP camera with 0.55um microlens for high-resolution 2D/3D DFF inspection and AI-powered inspection algorithms. The TR7950Q SII is suitable for the Wafer Macroscopic 3D Inspection and micro measurement metrology.
