News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation.
07 January 2025 - Yokogawa Test & Measurement Corporation released its AQ2300 series high-performance, high-speed SMU (Source Measure Unit) into the European marketplace. Addressing various density needs for semiconductor/communication devices, the AQ2300 series modular SMU offers high-quality pulse generation alongside high-precision voltage/current generation and measurements. Thanks to its inherent productivity and expandability characteristics, the 2-channel SMU module also saves time and space when performing the typically complex measurement functions essential for semiconductor devices.
Read more: High-Precision SMU for Test of Semiconductor Devices
19 December 2024 – Advantest announced an integrated test cell designed to maximize die-level test yields for wide-bandgap (WBG) devices essential to power semiconductors. The Advantest Known Good Die (KGD) Test Cell combines the company’s CREA MT series power device testers with the new HA1100 die prober. Currently under development, the HA1100 die prober will be released to the global market in the second quarter of 2025.
04 December 2024 – Advantest announced a new power multiplexer developed specifically for use on the V93000 EXA Scale SoC test platform. The PMUX02 Power MUX offers unprecedented capabilities for multi-site testing of power and analog devices, including battery management systems (BMS), automotive, and power management ICs. With 22 switches – nearly double the switch density of its predecessor – and an extended voltage range of ±160 volts (V), PMUX02 will help streamline and reduce the cost-of-test for these high-pin-count, mixed-signal devices.
Read more: Power Multiplexer for Test of High-Current Devices
14 November 2024 - Keysight Technologies introduced a 4881HV High Voltage Wafer Test System, expanding its semiconductor test portfolio. The solution improves the productivity of power semiconductor manufacturers by enabling parametric tests up to 3kV supporting high and low-voltage in one-pass test. Manufacturers have traditionally measured wafers using separate testers for high and low voltages. However, demand for power semiconductors is rapidly growing due to their multifunctionality, higher performance, and next-generation devices such as silicon carbide (SiC) and gallium nitride (GaN).
Read more: High Voltage Wafer Test System for Power Semiconductors
11 November 2024 - With many years of experience in probe card testing, Seica has designed and developed the Pilot VX HR XL platform, a flying probe system that offers a comprehensive, turnkey solution for testing probe cards that will be on display premier at Semicon Europe, Hall C2 Booth 160. This vertical system combines hardware and software in a single platform to perform three different types of tests: testing individual MLO and PCB boards before assembly, in-circuit (ICT) and functional testing of PCBs after assembly, and final testing of the probe card, which involves combining the PCB with the MLO.
