News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation.
06 November 2024 - Keysight Technologies introduced PathWave Advanced Power Application Suite, a software platform designed to accelerate battery testing and design processes. The platform consolidates PathWave’s IV Curve Measurement software, Advanced Power Control and Analysis, and Advanced Battery Test and Emulation, into a single comprehensive test environment. The platform also eliminates the need for complex workflows and time-consuming processes which can lead to error prone results.
01 November 2024 - OMRON launched the VT-X950, the latest model in its lineup of CT-type automatic X-ray inspection systems. The VT-X950 joins the VT-X750-XL and VT-X850, expanding OMRON’s offerings of high-speed 3D inspection systems. These systems are designed to meet the increasingly complex demands of semiconductor manufacturing and other advanced industries. The VT-X950 stands out as the first model in the VT series specifically designed to support clean rooms, making it ideal for mid-process semiconductor environments, such as wafer-to-wafer bonding processes.
Read more: OMRON launched 3D-AXI Automated X-Ray Inspection System
28 October 2024 – Test Research, Inc. (TRI) announces the release of the high-throughput 3D SEMI CT AXI TR7600 SIII Plus, specifically designed for high-reliability electronics manufacturing, including the Semiconductor and Advanced Packaging industries. Equipped with a Multi – High-Resolution configuration 2 µm - 20 µm, the TR7600 SIII Plus is an optimal addition to high-reliability electronics manufacturing industries such as Automotive, Aerospace, and Medical. The TR7600 SIII Plus delivers High-Speed Inspection tailored to the throughput requirements of OSATs (Outsourced Semiconductor Assembly and Test providers) and integrates AI-Powered Inspection Algorithms, including AI-Void Detection and AI Repair Station to enhance defect detection rates.
15 October 2024 - Chroma launched a new UIS (Unclamped Inductive Switching) function module for its 3650 series test systems. Specifically designed for avalanche testing, this module is particularly suitable for third-generation semiconductor materials such as Gallium Nitride (GaN) and Silicon Carbide (SiC). The UIS module addresses a long-standing challenge in the industry—obtaining complete and accurate test data and waveform information.
Read more: Function Module for Semiconductor Avalanche Testing
04 October 2024 – Viavi Solutions presented a new optical connector inspection solution for next-generation transceivers. The FVAM-2000 is the latest addition to the company’s benchtop microscopy line and, along with other new optical and Ethernet testing solutions, was on display at VIAVI Stand during ECOC 2024, September 23-25 in Frankfurt, Germany. ECOC is Europe’s largest exhibition in the optical communication technology industry.
