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Readers Top 5 News of last 30 days
News - Board and System TestiSYSTEM introduces Wireless Debugger29 November 2013 – iSYSTEM introduced industry's first truly wireless debugger. The iONE-BT allows the wireless communication between a target application and a PC running iSYSTEM's winIDEA/testIDEA debugging and test software, via Bluetooth. The iONE-BT consists of two modules: A debug module which attaches to the target via standard connections (ie, JTAG) and which contains a Bluetooth antenna and a Bluetooth dongle which attaches to the host PC by USB. N4L appointed distributor for Bulgaria, Greece, Romania and Serbia27 November 2013 - N4L, a manufacturer of test and measurement instruments for power electronics based in UK, announced that Neurotex Ltd have been appointed as official distributors for Bulgaria, Greece, Romania and Serbia for all N4L equipment following the delivery of formal training to Neurotex staff at Newtons4th head office in the UK. Compliance Testing Application for SFP+ and QSFP+ Ethernet Standards25 November 2013 – Agilent Technologies introduced a compliance testing application for devices that use SFP+ (enhanced small form-factor pluggable) standards in networking and server applications. Agilent’s solution for transmitter tests includes SFP+ and optional QSFP+ (quad-enhanced small form-factor pluggable) test standards as described in the SFF-8431 specification. The N6468A SFP+ Ethernet compliance application can be used with all currently shipping Infiniium real-time oscilloscopes that have bandwidths of 25 GHz or more. Solder Paste Inspection with optimized 3D Calculation20 November 2013 - GOEPEL electronic‘s 3D Solder Paste Inspection (SPI) system OptiCon SPI-Line 3D is already one of the fastest SPI systems and captivates with its extraordinary measuring accuracy. At the 2013 productronica, the Company introduced the new integrated system software SPI-Pilot 1.4 with optimized 3D calculation and numerous additional highlights. TRI premieres new 3D AOI Solution at Productronica 201315 November2013 – Test Research, Inc. (TRI) will introduce its newest full coverage 3D AOI solution along with a complete range of inspection solutions at Productronica 2013 in Munich between November 12 and 15, 2013. TR7500 SIII 3D is a top of the line 3D AOI solution, bringing together complete 5-camera coverage and accurate 3D height inspection. By combining newest technologies, the TR7500 SIII 3D delivers highly accurate all-around defect coverage with a powerful and easy-to-use software interface, making post-reflow assembly inspection a breeze. JOT Automation to show new Inline Routing Solution at Productronica15 November 2013 - JOT Automation shows its new JOT Router, a small inline routing solution for automated depaneling of PCBs used in smart devices like mobile and smart phones, tablet computers, PCs, motherboards and automotive electronics. The cost effective system consists of a cutting unit, available both as single and dual spindle and is designed as a modular system, a key benefit of the product. It is also available with different options for material out feeding, including a tray feeder and flat belt conveyer. SPEA presents new Flying Probe and Bed-of-Nails Testers14 November 2013 - SPEA will present its next generation of automatic board testers – flying probe and bed-of-nails systems – at their booth #255 (Hall A1) in Productronica, that will be held in Munich November 12 th to 15 th, 2013. After years of success worldwide with over 1000 systems installed, SPEA is launching Flying Probe S2, the Multi Core Flying Probe tester series. More Articles ...
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