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Readers Top 5 News of last 30 days
- 22 May 2018 - Ultra-high Precision, self-contained Digitizers
- 30 May 2018 - Software to simplify Development and Debugging of Automated Test Systems
- 23 May 2018 - Infrastructure for Deployed Systems Management
- 25 May 2018 - Over-the-Air (OTA) Integrated Test Solution for Antenna in Package
- 28 May 2018 - 2x2 MIMO Measurement Function for Evaluation of WLAN Equipment
News - Board and System Test
Low-Cost USB Type-C Protocol Analyzer
20 June 2018 – Teledyne LeCroy announced the release of the new Mercury T2P Analyzer, a low cost, robust USB Type-C Protocol Analyzer that offers confidence in results that are not available from alternative open-source or shareware-based analyzers. With upgraded VBUS (power) analysis and optional support for DisplayPort Auxiliary channel message decoding, the Mercury T2P analyzer has full support for USB 2.0 protocol testing and adds advanced USB Type-C analysis capabilities.
Testing new AUTOSAR 4.3 Features
18 June 2018 - The development tool of dSPACE offers comprehensive functionality for the development and validation of some of the latest AUTOSAR 4.3 features. Technologies that have posed a challenge for many developers, such as secure onboard communication (SecOC), global time synchronization (GTS), and enhanced end-to-end (E2E) protection, can now be developed and tested directly with dSPACE’s tools. In addition, dSPACE can use its technical know-how to provide extensive support for customers and assist them in the introduction and validation of the new features.
New Functions for compact Production Tester
15 June 2018 - GOEPEL electronic enhanced JULIET, the JTAG/Boundary Scan desktop production tester for electrical assemblies with new functions. They contribute to the further development of safety in production. The new functions also make it possible to program assemblies at high-speed. The table-top test system combines the entire electronic system and the test unit adaption in one complete device.
Improved inspection of Solder Pastes, Sinter Pastes and DCB Substrates
08 June 2018 - GOEPEL electronic has upgraded the inline inspection system SPI Line · 3D. In addition to 3D solder paste inspection, the SPI Line · 3D now has new features for testing sinter pastes and Direct Copper Bonded (DCB) substrates. Due to the high precision of the system in conjunction with the new functions, process errors in sinter paste printing can now also be detected. Even the smallest defect structures such as voids and particles with heights below 20 µm can be detected with reproducible results.
PCI Express Test Solution with Multivendor Oscilloscope Support
06 June 2018 – Anritsu developed a PCIe test and compliance test solution in collaboration with Granite River Labs (GRL) and Teledyne LeCroy. The test solution supports both PCI Express transmitter and receiver tests using automation software for the MP1900A. It also enables connection of customers’ oscilloscopes with the MP1900A by supporting real-time oscilloscopes from the three main manufacturers, permitting automation of complex receiver tests required for evaluating devices in accordance with the PCI Express standards.
DDR5 and LPDDR5 Protocol Debug and Validation Solutions
05 June 2018 - Keysight Technologies announced the first DDR51 and LPDDR52 Protocol Debug and Validation solutions. These solutions, when used in conjunction with Keysight's U4164A logic analyzer, enable designers of enterprise servers, mobile devices, and wireless equipment to debug and test DDR5 and LPDDR5 systems as well as validate protocol compliance.
2x2 MIMO Measurement Function for Evaluation of WLAN Equipment
29 May 2018 – Anritsu launched a new 2x2 MIMO Measurement Software MX886200A-010 option for the Wireless Connectivity Test Set MT8862A. This latest release extends the measurement functions of the MT8862A to offer support for evaluating 2x2 MIMO WLAN equipment.
More Articles ...
- IPTE expands Location in the United States
- Free JTAG DFT Assistant for Mentor Xpedition
- Communication Controller supports up to 18 Bus Interfaces
- Compliance Test Solution for PCI Express3.0 Link EQ Test and Rx Test
- Validate the Performance of eCall Modules
- End-to-End 5G NR-Ready Channel Emulation Solutions
- Fault Insertion Module to Simulate Fault Conditions
- Wireless Test Set supports latest 5G Sub-6 GHz Tests defined by 3GPP
- Monitoring of CAN FD Automotive Serial Bus
- Signal Analyzer supports new 3GPP 5G Standards
- Yamaha enters Solder Paste Inspection Market
- High Throughput Manufacturing Test of 400G Modules
- Test Application Framework with new Tools and Backup Capabilities
- Test of LTE Cat-M1 and NB-IoT Devices
- WLAN Signaling Tester for IEEE 802.11ax
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