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Readers Top 5 News of last 30 days
Latest Test and Measurement NewsHighly functional Safety Tester according to the latest Standards
Fluke announces Expansion of Premium Care Support Packages
Compact Solution for 3D THT Inspection
170 GHz Power Sensors for D-band
Versatile Antenna OTA Test Solution for Integration in EMC Chambers
Modular and affordable Audio Analyzer
JTAG Integration for Seica Flying Prober
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01 December 2023 - Since the end of the transition period in September 2023, periodic testing of electrical equipment must comply with DIN EN 50699 requirements. Gossen Metrawatt has a future-proof solution on hand and offers the latest generation of its SECUTEST ST device tester series at particularly attractive conditions.
30 November 2023 - Fluke announced the expansion of its Premium Care support packages to include a wider range of market-leading industrial and electrical tools. Fluke Premium Care covers the routine calibration and performance checks of tools to ensure compliance with the latest standards as well as the repair and replacement of damaged accessories. Top priority technical support is also offered to enable customers to solve critical equipment challenges faster. Selected tools from Fluke’s range of acoustic imagers, power quality analysers and loggers, multifunction PV testers and performance analysers, ScopeMeters, motor drive analyzers and process calibration tools can now be covered by Fluke Premium Care.
29 November 2023 - Mek (Marantz Electronics) launched during productronica show in Munich the new SpectorBOX X series, a modular full 3D AOI system for THT solder joints and THT components. SpectorBOX X1 is an industry game-changer that redefines Through-Hole Technology (THT) inspection and can be used bottom-up for volume measurement of THT solder joints and pin height measurement, or Top-Down for a groundbreaking 150mm + clearance for 3D THT components measurement - making it the first compact 3D AOI system truly capable of inspecting THT solder joints and components with precision.
28 November 2023 - Rohde & Schwarz launched the new R&S NRP170TWG(N) thermal power sensor for precise power level measurements in the D-band. It is the only RF power sensor on the market that offers full traceability to national metrology institutes (NMI) in the frequency range from 110 GHz to 170 GHz, an important prerequisite for commercializing the frequency band. The R&S NRP170TWG(N) hardware is designed to reduce measurement noise and drift, while remaining very accurate and easy to use. The sensors are fully calibrated plug & play devices that can be easily integrated into any measurement setup with a USB or LAN connection.
27 November 2023 – RanLOS, TOYO Corporation (TOYO), AeroGT Labs, and Anritsu announced the availability of the first 5G antenna over-the-air (OTA) measurement system engineered with RanLOS’ OTA test solution and Anritsu’s 5G Radio Communication Test Station MT8000A. The new system represents a significant step forward in enabling advancements in 5G connected vehicles.
24 November 2023 – Audio Precision launched the new APx516B audio analyzer. Tailored for R&D, production testing, and other audio engineering applications, the APx516B offers comprehensive analog and digital audio testing in a versatile and affordable package. Digital audio has become an integral component of modern audio devices. From smartphones to AV receivers, the digital transition is evident. The motivation for this shift is clear: higher fidelity sound, advanced features, and the ability to convey more data than traditional analog methods. As of 2022, more than 75% of new audio devices have adopted some form of digital audio I/O.
23 November 2023 - The successful partnership between GÖPEL electronic and Seica in the world of embedded JTAG solutions is growing: GÖPEL introduced the integration of the new PicoTAP ATE into the test systems from the Italian manufacturer Seica. The PicoTAP ATE controller provides a low-cost alternative for applications from basic boundary-scan test to processor-assisted test (VarioTAP) and FPGA-assisted test (ChipVORX). The compact and lightweight package enables simple installation right on a flying probe head of a Seica Pilot tester. The Flying Prober features the so-called FlyPOD, a compact probe block which can contact multiple test pads on the printed-circuit board assembly (PCBA) with a single probe movement.