 |
 |
Main Menu
Newsletter
News Area
Info Area
Weblinks
Product Focus
How to resolve AdBlock issue? Readers Top 5 News of last 30 days
- 06 September 2024 - 14-bit Precision Oscilloscope for general Applications
- 05 September 2024 - Beckhoff’s Measurement Terminals in Vehicle Development
- 12 September 2024 - 1.6 Tb/s High-Speed Ethernet Testing for AI Workloads
- 11 September 2024 - Field Test of Automotive Radar Sensors
- 09 September 2024 - Next-Generation Automotive CAN XL Network Interface
News - Component Test
Optical Connector Inspection Solution
04 October 2024 – Viavi Solutions presented a new optical connector inspection solution for next-generation transceivers. The FVAM-2000 is the latest addition to the company’s benchtop microscopy line and, along with other new optical and Ethernet testing solutions, was on display at VIAVI Stand during ECOC 2024, September 23-25 in Frankfurt, Germany. ECOC is Europe’s largest exhibition in the optical communication technology industry.
16k TDI Line Scan Camera for Wafer Inspection
24 September 2024 – Teledyne DALSA introduced the Linea HS2 TDI line scan camera family. Designed for ultra-high-speed imaging in light starved conditions, it delivers exceptional image quality with 16k/5 µm resolution and boasts an industry leading maximum line rate of 1 Megahertz, or 16 Gigapixels per second data throughput. The Linea HS2 features a highly sensitive Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor with 16k/5 µm resolution and optimized Quantum Efficiency, meeting the rigorous demands of current and future machine vision applications.
Wire Bond Inspection Solution for Semiconductor Manufacturing
03 September 2024 - Keysight Technologies introduces the Electrical Structural Tester (EST), a wire bond inspection solution for semiconductor manufacturing that ensures the integrity and reliability of electronic components. The semiconductor industry is faced with testing challenges due to the increasing density of chips in mission-critical applications such as medical devices and automotive systems. Current testing methodologies often fall short in detecting wire bond structural defects, which lead to costly latent failures. In addition, traditional testing approaches frequently rely on sampling techniques that do not adequately identify wire bond structural defects.
SoC Tester Platform - continually enhanced and expanded over 25 Years
21 August 2024 – Advantest celebrates the 25th anniversary of its flagship V93000 system-on-chip (SoC) test platform. The V93000 revolutionized the semiconductor test industry with its single scalable platform approach, enabled by its test processor-per-pin architecture, which has endured over four generations. As a testament to this endurance, the very first V93000 system installed is still in use at the customer site in Italy, alongside several recently purchased fourth-generation V93000 EXA Scale testers.
Audio Test Board for SoC Tester
19 August 2024 - In the fiercely competitive consumer electronics market, high-end audio products like wireless headphones, TWS earbuds, multi-channel gaming headsets, and wireless speakers are powerful drivers of innovation and growth. As competition heats up in the mid to low-end segments, manufacturers are packing their products with advanced features. High-bitrate codecs, low power consumption, smart charging, smart noise cancellation, multi-microphone calling, health tracking - everything to stand out and stay competitive.
New Wafer Inspection and Metrology Solution
06 August 2024 - Test Research, Inc. (TRI) will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 4F from September 4 - 6, 2024 and will be exhibiting the new Wafer Inspection Platform, TR7950Q SII, featuring a 25MP camera with 2.5 μm resolution and a 12MP camera with 0.55um microlens for high-resolution 2D/3D DFF inspection and AI-powered inspection algorithms. The TR7950Q SII is suitable for the Wafer Macroscopic 3D Inspection and micro measurement metrology.
Aehr Test Systems to acquire Incal Technology
30 July 2024 – Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, announced it entered into a stock purchase agreement to acquire all of the outstanding capital stock of Incal Technology, Inc., a Fremont, California-based, privately held manufacturer of packaged part reliability/burn-in test solutions used by a significant number of leading Artificial Intelligence (AI) semiconductor manufacturers.
More Articles ...
- PXI, PXIe, and LXI Modules for Semiconductor Parametric Testing
- Background: Using On-Wafer Broadband Calibration Substrates
- Test Software achieves ASPICE Level 2 Certification
- Test Board solves RF Testing Challenges
- High-Current Power Supply for SoC Test System
- Radio Frequency Circuit Simulator for RFIC Chip Designers
- Enhanced MicroLED Display Manufacturing Efficiency
- Advanced Packaging 3D CT AXI Solution
- Advantest appointed new Group CEO
- Handheld LCR Meter with selectable Measurement Speed
- ASA Motion Link Test Methodology
- Cooperation for 5G/IoT Device Testing
- Real-Time Data Infrastructure Platform for Semiconductor Test
- Advantest launched new Group of Memory Test Products
- Handler with active thermal Control
Related Articles:
Upcoming Events
More events...
See our Trade Show Calendar
Click here
Tag Cloud
© All about Test 2018