|
||||
News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation. | ||||
Main MenuNewsletterNews AreaInfo AreaWeblinksProduct Focus |
Readers Top 5 News of last 30 days
News - Component TestNew Approach to Wafer-level Unattended Over-temperature Test10 August 2010 - Cascade Microtech, Inc. announced two new probe station features that allow semiconductor manufacturers to perform on-wafer measurements and collect data over a wide range of temperatures, reducing time inefficiencies and increasing productivity. VueTrack provides on-site probe tip tracking and delivers highly accurate probe-to-pad alignment, and the new High Temperature Stability (HTS) enhancement helps to eliminate errors caused by thermal drift. Vi TECHNOLOGY launches the REVEAL Imager AOI Series14 July 2010 – Vi TECHNOLOGY introduces the REVEAL Imager Series, at SEMICON West 2010 from July 13th to 15th, Booth 5377 - North Hall – San Francisco Moscone Center. Along with the product an automatic JEDEC Tray loader compatible with both REVEAL Imager and REVEAL MEMS Series will be demonstrated. Direct-ProbeTM Solution for Verigy V9300002 July 2010 - Verigy has extended the scalability of its production-proven V93000 platform by adding the Direct-Probe™ solution. This high-performance probe test capability for digital, mixed-signal and wireless communication ICs delivers one of the highest signal integrity levels available for production-volume, multi-site probe testing. Related Articles: |
Upcoming Events More events...
Tag CloudOscilloscope
JTAG
Boundary Scan
Goepel
PXI
Rohde & Schwarz
Tektronix
Keysight
AOI
Anritsu
National Instruments
Inspection
Teledyne LeCroy
Aeroflex
LTE
Yokogawa
AXI
Spectrum Analyzer
Keithley
In-Circuit-Test
Signal Analyzer
Automotive
EMC-Test
Signal Generator
Advantest
Multitest
B&K Precision
Corelis
Power Supply
SPI
Flying Prober
Teseq
Cognex
Switching
Teradyne
Viscom
Pickering
Fluke
GAO Tek
PCIe
|
||
© All about Test 2018 |