|
||||
News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation. | ||||
Main MenuNewsletterNews AreaInfo AreaWeblinksProduct Focus |
Readers Top 5 News of last 30 days
News - Component Test3-in-1 Semiconductor Test Clock Module for testing High-Speed ICs13 July 2012 - Advantest Corporation announced the new T2000 LJC16 16-channel, low-jitter-clock module. The LJC16 module combines different digital clock and analog clock/sine-wave requirements in a single high-multi-site system. By using the new LJC16 module all necessary tests can be performed on one tool without needing multiple modules. Multitest’s Solution for 3D Packages Released to Production10 July 2012 - Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that the first Multitest Plug & Yield solution for the test of 3D packages has recently been released to the customer’s production. Geotest introduces new Manipulator Option and Receiver for Semiconductor Test System05 July 2012 - The TS-900 Semiconductor Test System from Geotest is now available with a new manipulator option and handler compatible receiver. The Reid-Ashman OM1069 manipulator is designed specifically for the TS-900 and allows precise positioning and flexibility for interfacing to automated probers and device handlers. The manipulator's spring loaded design allows for easy alignment and docking to handlers – eliminating the need for a complex receiver interface. Hua Hong NEC and Advantest Develop Wafer-Level Test Solution for RFID Devices02 July 2012 - Shanghai Hua Hong NEC Electronics and Advantest have collaborated to successfully develop a wafer-level, multi-site parallel test solution for radio-frequency identification (RFID) semiconductor devices that meet industry-standard ISO 14443 guidelines. This new test methodology is now being used to improve the cost efficiency of volume-production testing at Hua Hong NEC and, most importantly, has already met with approval from the foundry’s key customers. Orbotech expands Ultra Fusion AOI Series29 June 2012 – Orbotech announced that it has expanded its Ultra Fusion series of automated optical inspection (AOI) systems. The new Ultra Fusion 300 is designed to support the production of advanced IC substrates down to 10μm. In addition to Ultra Fusion 300, the Company also offers the recently launched Ultra Fusion 200 for IC substrate and advanced HDI production down to 15μm. Fully-Automatic Measurement Probe System for Power Devices26 June 2012 - Cascade Microtech introduced the new APS200TESLA. This innovative, turn-key system combines the proven capabilities of its Tesla on-wafer power device characterization measurement technology with Cascade Microtech's BlueRay production automation technology to deliver the industry's first complete on-wafer production solution to address the test challenges of discrete power devices. Stable and high parallel Handling Solutions for various Applications15 June 2012 - Multitest, a designer and manufacturer of final test handlers, contactors and load boards, announces that its InCarrier Loader/Unloader is available in a variety of configurations, e.g. for loading from tube, bowl, tray and for unloading into tube, bulk or metal mag in any combination. Additionally, partner solutions for loading from wafer ring or unloading into tape-and-reel can be offered. More Articles ...
Related Articles: |
Upcoming Events More events...
Tag CloudOscilloscope
JTAG
Boundary Scan
Goepel
PXI
Rohde & Schwarz
Tektronix
Keysight
AOI
Anritsu
National Instruments
Inspection
Teledyne LeCroy
Aeroflex
LTE
Yokogawa
AXI
Spectrum Analyzer
Keithley
In-Circuit-Test
Signal Analyzer
Automotive
EMC-Test
Signal Generator
Advantest
Multitest
B&K Precision
Corelis
Power Supply
SPI
Flying Prober
Teseq
Cognex
Switching
Teradyne
Viscom
Pickering
Fluke
GAO Tek
PCIe
|
||
© All about Test 2018 |