MatriX Technologies extends its Product Line by an Inline 3D X-Ray Inspection System

02 December 2011 - The MatriX AXI Inline product range is extended by a new system series. The 3D inline x-ray system is currently available in two model type configurations: X3 as universal standard system and the X3+ with triple detector setup for high throughput requirements. Both systems are based on the hardware concept of the X2.5 platform well-established in serial production.

The newly developed 3D-Software uses a dedicated number of angle projections for 3D reconstruction and based on that delivers the 3D slice images needed for high quality solder joint analysis.  With the algebraic reconstruction method used (Simultaneous Algebraic Reconstruction Technique = SART) it is now possible to generate detailed, high resolution images for a reliable analysis with only a few projections.

The 3D inspection is particularly interesting for the analysis of double-sided boards with high packing density. The generated slice images allow a separate 3D analysis for both sides of the board. Other interesting applications are e.g. the inspection of high power components with heat sinks, where single contact layers can be separated for void or solder wetting analysis. In addition a multi-layer analysis of a solder joint – e.g. of critical BGA solder joints or of MCM modules - is possible with the digital 3D tomosynthesis technique. This detailed multi-layer analysis is time-critical. On the other hand for typically 80% of the solder joints on double-sided boards transmission x-ray is absolutely sufficient.

With the new X3 system series MatriX Technologies now offers exactly this combination of an optimized test concept that selectively uses the 3D technique where it is really needed. In parallel the well-proven „high speed“ transmission technique is used, which is significantly faster as far less image acquisitions are required.

The new 3D system series uses the well-established MIPS platform with links to all MIPS software modules for programming, classifying and verification. MIPS verify now supports the defect image verification with an extended 3D functionality. So the respective images of a defect can be displayed in different acquisition modes allowing comparison of e.g. transmission, angle shot and 3D slice image. In case of a combined AXI/AOI configuration a common verification dialog supplies x-ray and optical images for efficient processing.

For all existing X2.5 customers the AXI specialist offers an upgrade to the new 3D technology.