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Solder Paste Inspection with optimized 3D Calculation

Goepel-Opticon-SPI-3D20 November 2013 - GOEPEL electronic‘s 3D Solder Paste Inspection (SPI) system OptiCon SPI-Line 3D is already one of the fastest SPI systems and captivates with its extraordinary measuring accuracy. At the 2013 productronica, the Company introduced the new integrated system software SPI-Pilot 1.4 with optimized 3D calculation and numerous additional highlights.

SPI-Pilot 1.4 impresses by an enhanced algorithm for measured value determination, i.e. the OptiCon SPI-Line 3D System provides measurement data for volume, offset and height of solder deposit even more reliably.

Additionally, the new software offers an extended module for statistical process control (SPC) and further opportunities for real-time monitoring of the printing process. An easy-to-use control and well-organized display allow for the SPC module’s utilization also by a Tablet PC with touch operation. Fault and work statistics are displayed comfortably as charts and tables.

The new verification and classification station software in SPUI-Pilot 1.4 enables a very simple and efficient evaluation of test results. Hereby, interactions with e.g. ASYS buffer band modules are possible. This software range can also be controlled via a Tablet PC.

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