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Flexible 3D-AOI with high-performance Camera

Viscom S3088 ultra28 April 2014 – Viscom presents the new Viscom S3088 Ultra 3D-AOI system at SMT in Nuremberg (May 6 to 8, 2014). It combines the flexibility of the AOI systems of the Viscom S3088 family with the strengths of the high-performance camera module XM-3D. The S3088 AOI systems are designed to flexibly cover various requirements, from small series production to high-volume/low-mix manufacturing.

The XM-3D camera module allows especially fast inspections, with both high-resolution angled views and 3D analyses. With the XM-3D camera module, the Viscom S3088 Ultra has one of the fastest AOI camera systems on the market. The image data rate achieves up to 1,8 gigapixels per second. As a result, the new inspection system is more than twice as fast as the predecessor systems of the S3088 family. As an additional benefit, it offers all the possibilities of 3D-measurement technology in the XM-3D sensor head. It works with an integrated structured light projector for image fields of up to nine views. This permits exact 3D analyses of for example lifted leads, surface chips or IC coplanarity defects.

But even the classic AOI functions are located at the performance peak. Through high-resolution angled views, the S3088 Ultra reliably recognizes critical defects. With the OnDemandHR function, the optical resolution of 16 µm (standard resolution) can be converted to 8 µm (high resolution). In this way, the system is also able to reliably check 03015 type components.. Color pictures, supplemental photographs, picture sequences: The high photographic speed, extremely high resolution, and excellent image quality open the most varied options for use.

The S3088 Ultra offers all the advantages of the Viscom S3088 family: The fast computer and TouchScreen monitor ensure high computing performance and simple, fast operation. Additionally, the new AOI system is designed both for the inspection software vVision and for EasyPro.

A further highlight is the Viscom FastFlow transport. It achieves extremely high throughput in printed circuit board handling. Electronic assemblies can be fed in and out synchronously. Additionally, with a width of just under 1 meter and a depth of somewhat over 1.5 meters, the system is especially compact. That means maximum performance with a minimum footprint.

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