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CAMTEK announces Semiconductor Inspection and Metrology Platform

02 April 2014 – Camtek started the customer evaluation of its next generation Semiconductor Inspection and Metrology platform designed for the Advanced Packaging market. The new systems deliver unparalleled 2D and 3D inspection and metrology capabilities for wafers, both before and after testing, along the bumping process or after dicing.

The fast-growing Advanced Packaging market relies critically on advanced inspection and metrology capabilities to achieve the affordability and reliability required for the commercial success of 3D Integrated Circuits (IC).

Ramy Langer, Vice President and Head of Camtek's Semiconductor Division, commented, “Our next generation platform is a result of many years of dedicated research and development efforts, as well as intensive collaboration with leading research institutes worldwide. Designed to support the emerging Advanced Packaging market, this new state-of-the-art platform will provide higher throughput, unparalleled accuracy and other innovative capabilities. We expect sales of the new system to customers specializing in the manufacturing of 3D IC to begin in the second half of 2014.”

Rafi Amit Chairman and CEO commented, “I am excited to lead the introduction of our new system that meets today’s demand for very high throughput together with outstanding metrology accuracy. I believe our new generation system will reposition and cement us as a market leader in the inspection and metrology field over the coming years.”


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