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Readers Top 5 News of last 30 days
News - Board and System TestSimulation Tool for efficient Suspension Design and Analysis02 May 2013 - dSPACE Automotive Simulation Models (ASM) now support the simulation of virtual test benches for vehicle dynamics analysis. The new ASM Kinematics and Compliance (ASM KnC) provides functions for designing and simulating wheel suspensions on a virtual test bench, thereby opening up a new, innovative application field. Users can now run virtual tests for numerous vehicle variants and driving maneuvers to optimize vehicle sus-pensions and make them available for hardware-in-the-loop (HIL) applications. Double-Sided AOI for SMD and Pin-In-Paste in one System02 May 2013 - GOEPEL electronic upgraded its AOI system OptiCon TurboLine, widely used for PCB top and bottom inspection in production for automotive products. An additional integrated camera module for PCB bottom side enables inspection of pin-in-paste (THR) solder joints together with the SMD inspection in one system. New PXI Controller supports four Test Technologies30 April 2013 – With the new PXI-based controller for ASSET InterTech’s ScanWorks platform for debug, validation and test, engineers can test circuit boards with four different toolsets, each based on a different test technology. Operating from a personal computer and a PXI chassis, the new ScanWorks PXI-1000 controller can apply boundary-scan tests based on the IEEE 1149.1/6 standards (JTAG), processor-controlled tests (PCT), FPGA-controlled tests (FCT) and access instruments embedded in chips via the IEEE P1687 Internal JTAG (IJTAG) standard. Top/Bottom AOI for THT with Matrix Cameras and Multispectral Illumination26 April 2013 - GOEPEL electronic enhanced its AOI system OptiCon THT-Line with revolutionary developments. According to the respective requirements of a production process, THT component and solder joint side inspection can be executed at several positions in a production line, either at the upper conveyer belt or during the PCB return in the lower system area. Corelis releases new Version of Boundary-Scan Tool Suite24 April 2013 – Corelis announced the availability of version 7.8 of its ScanExpress Boundary-Scan Tool Suite. This new version includes numerous new features and enhancements including improved cluster testing support, intelligent BSDL file handling, and a new model-based test coverage. The new version also expands JTAG Embedded Test (JET) support to Texas Instruments AM335x Sitara processors. Direct Monitoring of HDMI/HDCP Audio Outputs23 April 2013 – Tektronix expanded its line of waveform monitors and rasterizers with its new WFM and WVR5250 models, the only products in their respective classes to offer HDMI-HDCP inputs that enable broadcasters, operators and equipment manufacturers to directly monitor the quality of the video and audio output of set-top boxes (STBs) and Blu-ray players for the first time. 3D Solder Joint Inspection23 April 2013 - Omron presents the new VT-S500, a solution to providing next-generation, 3D inspection capability at minimal cost. With revolutionary 3D image processing, the VT-S500 accurately analyzes the topographical features of solder fillets to ensure PCB quality and reliability. More Articles ...
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