|
||||
News and Information about the Test of Electronics in Research & Design, Production, Maintenance, and Installation. | ||||
Main MenuNewsletterNews AreaInfo AreaWeblinksProduct Focus |
Readers Top 5 News of last 30 days
News - Board and System TestValidation of 5G RAN Platform for Small Cells23 August 2022 – Anritsu Corporation announced that Qualcomm Technologies, Inc. has validated Radio Communications Test Station MT8000A which is now supported by the Qualcomm Development Acceleration Resource Toolkit (QDART) for testing 5G NR Sub-6 GHz small cells using the Qualcomm 5G RAN Platform. Different 5G small cells, such as femtocells, picocells, and microcells, all have different coverage. Small cell BTS are used when requiring high data rates and density in indoor areas and crowded places, such as shopping malls and sport stadiums. Nordson Corporation announced acquisition of CyberOptics Corporation18 August 2022 – Nordson Corporation signed a definitive agreement for the acquisition of CyberOptics Corporation, a global developer and manufacturer of high-precision 3D optical sensing technology solutions. The acquisition enhances Nordson’s test and inspection platform, providing differentiated technology that expands Nordson’s product offering in the semiconductor and electronics industries. Research finds Automated Testing Remains a Significant Challenge for Organizations17 August 2022 - Keysight Technologies announced the results of a global study, conducted by Forrester, that surveyed test operations decision-makers to understand the state of test strategies and technologies. The research report, titled Conquer Testing Complexities with Automation and Artificial Intelligence (AI), identified that automation is gaining inroads, with 75% of organizations using a combination of automated and manual testing. However, only 11% have a fully automated strategy. With growing complexity, the number of tests is increasing (77%) and without automation, product development slows. First PCI Express 5.0 Mini Cool Edge IO (MCIO) Interposer08 August 2022 – Teledyne LeCroy announced a PCI Express 5.0 Mini Cool Edge IO (MCIO) interposer that works in combination with Teledyne LeCroy’s Summit family of PCI Express 5.0 protocol analyzers. The new interposer enables engineers to test products that incorporate card edge connectors or cabled connector assemblies that utilize the MCIO mechanical connector with PCIe 5.0, NVM Express (NVMe) or Compute Express Link (CXL) technologies. The PCIe 5.0 MCIO Interposer joins the list of CrossSync PHY enabled interposers, allowing users to debug enhanced power management and link training equalization through correlated and time aligned physical and protocol layer views. E-Field Probe for EMC Immunity Measurement up to 40 GHz03 August 2022 – ETS-Lindgren launched the new EMSense 40 E-Field probe for automotive, MIL-STD, and commercial EMC RF immunity measurement. The laser-powered EMSense 40 Electric Field Probe embodies the latest innovations in isotropic sensor design, low noise, and miniaturized electronics. Designed for a single probe frequency range from 10 MHz to 40 GHz, the EMSense 40 can read data continuously over the entire dynamic range. In addition, data values for each axis (X, Y, and Z) can be read individually or summed. Test Profiles for eSIM Device Testing29 July 2022 - Mobile devices with a conventional SIM card interface were previously configured via a special test SIM card so that they were optimally prepared for testing with the intended network simulator in the test lab. For mobile devices containing a physically inaccessible eSIM (embedded SIM), this device configuration now takes place digitally via the COMPRION eSIM Test Profile Service. COMPRION and Rohde & Schwarz have now developed R&S specific eSIM test profiles for testing with network simulators from Rohde & Schwarz such as the R&S CMX500. Automotive Data Logger captures multiple Data Streams simultaneously28 July 2022 - Saelig Company introduced the X2E XORAYA Z7 Automotive Datalogger, which can record data from multiple different automotive bus systems simultaneously. All data is logged with a precise, central timestamp with 100ns resolution and either saved on the internal SSD or transferred to an external computer system via Ethernet. Optionally, the logged data can be stored on a XORAYA external storage unit. Logging is currently implemented for LS-CAN, HS-CAN, CAN FD, FlexRay, RS-232, LIN, MOST25, MOST150, Ethernet, BroadR-Reach (OABR), PSI5 and analog signals, with additional bus systems in development. Harman-Becker’s GNLog protocol and the DLT protocol can also be recorded via Ethernet, OABR, and RS-232. More Articles ...
Related Articles: |
Upcoming Events More events...
Tag CloudOscilloscope
JTAG
Boundary Scan
Goepel
PXI
Rohde & Schwarz
Tektronix
Keysight
AOI
Anritsu
National Instruments
Inspection
Teledyne LeCroy
Aeroflex
LTE
Yokogawa
AXI
Spectrum Analyzer
Keithley
In-Circuit-Test
Signal Analyzer
Automotive
EMC-Test
Signal Generator
Advantest
Multitest
B&K Precision
Corelis
Power Supply
SPI
Flying Prober
Teseq
Cognex
Switching
Teradyne
Viscom
Pickering
Fluke
GAO Tek
PCIe
|
||
© All about Test 2018 |