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First PCI Express 6.0 and CXL EDSFF Interposers

TLC Interposer27 April 2023 – Teledyne LeCroy announced availability of new PCI Express 6.0 EDSFF interposers, providing connectivity to Teledyne LeCroy’s PCI Express protocol analyzers using the latest PCIe 6.0 and CXL specifications for analysis of enterprise and datacenter small form factor (EDSFF) E1.S, E1.L, E3.x type solid-state drives (SSDs) and devices. These new interposers are based on the new Teledyne LeCroy TAP6 technology that reduces signal integrity issues for enhanced probing in high-speed projects.

EDSFF devices designed for high performance systems make up an important and growing segment of the enterprise and datacenter storage devices market. Based on the PCIe 6.0, NVMe and CXL specifications, the EDSFF interface can support speeds of up to 64GT/s. Now design and test engineers can test, identify issues, and optimize EDSFF (E1.S, E1.L, E3.x) type memory systems and solid-state drive performance using Teledyne LeCroy PCIe 6.0 EDSFF interposers.

These new Teledyne LeCroy PCIe 6.0 EDSFF Interposers support data rates of 2.5, 5.0, 8.0, 16.0, 32.0, and 64.0 GT/s with up to x16 link widths. It provides a simple and easy-to-use way to probe PCIe traffic between a host and PCIe add-in card. In combination with Teledyne LeCroy’s Summit family of PCI Express 5.0 protocol analyzers, the interposer now enables engineers to test product designs to 32 GT/s. Future Summit protocol analyzers, coming soon, will use the full potential of the PCIe 6.0 EDSFF Interposer at full 64 GT/s speeds.


Five new PCIe 6.0 EDSFF Interposer models have been added to the Teledyne LeCroy PCI Express test solutions product line. These interposers can connect with any of the Teledyne LeCroy PCIe 6.0 Summit protocol analyzers for data capture and analysis.

All products are available for immediate order.

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