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News - Board and System TestPAM4 Signal Analysis with Oscilloscopes07 April 2015 – Teledyne LeCroy announces a PAM4 Signal Analysis software for real-time oscilloscopes. This new set of analysis tools makes essential eye, jitter and noise measurements on all three eye openings of a PAM4 signal, a requirement for engineers who are designing next-generation electrical and optical links that seek to double data transfer rates by leveraging PAM4 signaling. 3D AOI Inspection of Solder Joints03 April 2015 - The inspection software PILOT 6 of the AOI systems from GOEPEL electronics offers the possibility of three-dimensional inspection of solder joints on chip components and IC pins. The data of the surface topography, generated by the integrated measuring module 3D·EyeZ, can be evaluated in many ways to determine the quality of the solder meniscus. Possible functions are the measurement of the soldier height on the component or the pin as well as measuring the tin covered area on the pad and the solder volume. USB 3.1 End-to-End Test Suite01 April 2015 – Teledyne LeCroy introduces the QPHY-USB3.1-Tx-Rx package for automated USB 3.1 transmitter (Tx) and receiver (Rx) compliance testing, characterization, and debug, creating a unique and comprehensive USB 3.1 test suite. With the new test package, USB 3.1 testing can be performed on both Gen1 (5 Gb/s) and Gen2 (10 Gb/s) devices under test according to the latest USB 3.1 specifications. Optical Modulation Analyzer for 400G Communications Testing31 March 2015 – Tektronix launched a new 45 GHz optical modulation analyzer (OMA) capable of supporting the latest 100G and next-gen 400G communications standards. With support for single-carrier or multi-carrier systems, the analyzer is tightly integrated with the recently announced Tektronix DPO70000SX 70 GHz ATI Performance Oscilloscope to provide multi-channel, high sample rate, low noise digitization of complex modulation signaling for testing coherent optical transmitters, transmission systems, and receivers. Inline AXOI system communicates with ASYS OIC Software30 March 2015 - The high-end 3D X-ray inspection system X-Line 3D from GOEPEL electronics now features a link to the OIC System (Overall Inline Communication) of ASYS Automatisierungssysteme. The OIC system visualizes the electronics production line and displays status, product and production process in real time. In parallel, all relevant production relevant data and availabilities are truthfully documented. 5G millimeter-wave Channel Sounding Test Solution25 March 2015 - Rohde & Schwarz and Fraunhofer Heinrich Hertz Institute (HHI) developed novel 5G channel sounding solution. The solution comprises the R&S SMW200A vector signal generator and the R&S FSW signal and spectrum analyzer in combination with a synchronization unit and application software from Fraunhofer HHI. The test solution supports the research activities aimed at exploiting the microwave and millimeter-wave spectrum within 5G networks. Rack-mountable Boundary Scan TAP Transceiver25 March 2015 - GOEPEL electronics presents a new rack-mountable SCANFLEX TAP transceiverfor testing and programming multiple units under test (UUT) using 16 parallel test access ports (TAP). The space- and power-saving SFX-TAP16/G-RM-FXT allows the use in the production line as well as in applications with large distances to the target. More Articles ...
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