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News - Board and System TestHigh-speed 3D Solder Paste Inspection07 June 2012 - GOEPEL electronic introduces a brand-new system for 3D solder paste inspection (SPI). The new solution named OptiCon SPI-Line 3D provides high level technology by extraordinary inspection speed and detection accuracy for automatic solder paste inspection. The new SPI system will be offered in three different configurations determined by pixel resolutions of 10 µm, 15 µm and 20 µm. An inspection speed of up to 90cm² can be achived. ASSET introduces two new ScanWorks Controller Kits for PCIe04 June 2012 - ASSET InterTech launched two new controller kits for its ScanWorks platform for embedded instruments to accelerate test throughput by plugging into the high-speed PCI Express (PCIe) bus in the personal computer where ScanWorks is running. The new controller kits can apply ScanWorks non-intrusive board tests (NBT) to a circuit board. Efficient Inline THT PCB Inspection04 June 2012 - GOEPEL electronic enhanced its AOI system OptiCon THT-Line for integration in THT production lines. The inspection system can be used for carriers sized up to 620 mm x 510 mm, whereby the AOI modules inspection area allows the test of PCBs up to 540 mm x 410 mm dimensions at a component height up to 80 mm. Depending on production organisation, carriers with or without assemblies can be returned in the lower part of the AOI system. 2D X-Ray Inspection within any Plane of a complete PCB07 December 2011 - Nordson DAGE announced with X-Plane a revolutionary option for their range of X-ray inspection systems. The new option uses a proprietary, patent applied for, tomosynthesis, or CT technique to create 2D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board. Integration of Boundary Scan into Flying Prober31 May 2011 - Within the scope of an OEM cooperation, GOEPEL electronic and SPEA developed a professional Boundary Scan option for the SPEA 4060 Flying Prober test system. This integration provides crucial benefits such as increased test and fault coverage as well as significant time savings in the automatic production process. High-Resolution SPI for Printing and Dispensing Processes31 May 2011 - Traqu is a high-resolution digital 3-D inspection device from Essemtec used for 3-D measurement and analysis in processes such as solder paste inspection (SPI). Measurement tasks are programmed with a few mouse clicks, and DXF and Gerber data can be imported. Improved Efficiency during Boundary Scan Test in Mass Production26 May 2011 - GOEPEL electronic introduces the worldwide first completely modular Gang test system with integrated UUT power supply. With the SFX-TAP16/G users are now able to test or program up to 16 boards in parallel, applying only one central SCANFLEX controller and without the need for additional hardware. The system utilisation also increases efficiency in the production at significantly reduced manufacturing costs. More Articles ...
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