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Readers Top 5 News of last 30 days
News - Board and System TestAutomated Inspection of Bonding Pads06 May 2011 - GOEPEL electronics’ OptiCon AOI systems can now be utilised for automated inspection of bonding pads for solder splashes, deformations and any other impurities in the micrometer range. Meeting these test tasks, an additional camera module with a resolution of 3 µm is available in the AOI systems. An adaptive illumination system and particularly developed inspection functions enable highest fault detection at extremely low false-call rate. TRI introduces new tiny ICT and fast SPI Solution05 May 2011 – Test Research Inc. (TRI) introduced two new machines, TR5001T and TR7007. The TR5001T is a tiny in-circuit tester with high testing speeds and accuracy. This Tiny TR5001T provides a maximum of 640 test points. Savings on operation costs and space, the tiny TR5001T can meet customers’ testing needs and it still has flexible test capabilities. Tool for AOI & SPI process improvement05 May 2011 - Process control and improvement requires detailed information about the total manufacturing process. Indentifying process issues at the earliest opportunity saves both time and money by avoiding costly investigation and rework. Omron has developed a range of tools to aid this process and includes the unique process improvement tool, QupNavi. Turn any USB Port into a complete Avionics 1553/429/717 Test Interface04 May 2011 - Data Device Corporation (DDC) introduces a new Multi-I/O Advanced Avionics Tester that connects to any USB port to provide comprehensive avionics test, simulation, and analysis support. The BU-67211UX combines up to two dual redundant MIL-STD-1553 channels, with up to eight user programmable Receive/Transmit ARINC 429 channels, and up to two user programmable Receive/Transmit ARINC 717 channels, while providing support for IRIG-B, CANbus, Serial I/O, and Discrete I/O interfaces. Nordson YESTECH upgrades AOI System and Software02 May 2011 – Nordson YESTECH presented the latest generation FX Series AOI and upgraded YESPC software. The FX Series AOI is equally well suited for high-volume or high mix manufacturing environments, providing fast throughput and high resolution for inspection of 01005 components. Nordson YESTECH’s Advanced Fusion Lighting and 5 megapixel color image processing technology provides complete inspection coverage with extremely low false failure rates. Test of High-Speed HSPA+ Wireless Devices29 April 2011 - Anritsu introduces a software option for its MD8480C W-CDMA/GSM Signaling Tester that enables testing for the latest W-CDMA/GSM devices supporting simultaneous 64QAM and MIMO. The MX848001E-17 Simultaneous 64QAM/MIMO option enables the MD8480C Signaling Tester to conduct protocol-based testing on new W-CDMA/GSM wireless devices that incorporate this feature. Communication Controller for MOST15028 April 2011 - GOEPEL electronic provides PXI 6161, an all-new communication controller supporting MOST150 based on the highly powerful Series 61. Using this new hardware platform, users are able to individually and flexibly configure the controller according to their individual needs. That means, GOEPEL electronic provides one-stop solutions in software and hardware supporting MOST150. More Articles ...
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