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Readers Top 5 News of last 30 days
News - Board and System TestBackplane Flying Probe Tester26 May 2011 – Spea introduced with the 4060 BP a Flying Probe Tester especially designed for testing backplanes and populated boards mounting any type of connectors. The test is fully automated, since the flying probes are able to directly contact the pins of the connectors, whose position is automatically acquired by the system. Multifunctional Boundary Scan Controller23 May 2011 - GOEPEL electronic introduced SFX/COMBO1149-(x), the first desktop compact controller within the framework of the Boundary Scan hardware platform SCANFLEX. The multifunctional controller enables the combination of numerous strategies for testing, programming as well as design validation, and is ready to support new and upcoming standards such as IEEE 1149.7 and chip embedded instrumentation (IEEE P1687). Highest scalability and future reliability are ensured by the integrated hardware extension slots. Fast and precise 3-D Paste Inspection16 May 2011 – When it comes to inspecting electronic assemblies, detecting defects in the early stages with a solder paste inspection is highly important. In order to make 3-D paste inspection even faster and more efficient, Viscom has equipped its high performance AOI system S3088 with the proven sensor technology from CyberOptics. This 3-D SPI sensor technology inspects the solder paste deposit with highest speed and precision. The first system with this sensor, the Viscom S3088 SPI, was be presented at the SMT in Nuremburg. Parallel ECU Test by powerful FlexRay Interface Module12 May 2011 - The recently introduced communication controller series PCI/PXI 6191 from GOEPEL electronic suits perfectly for the parallel test of ECUs (electronic control units) in end-of-line test systems, and specific tasks in testing network characteristics and integration utilities. To enhance their performance, they can be upgraded by up to two dual channel FlexRay interfaces. Viscom improves its AOI Inspection System11 May 2011 – Viscom is now offering the S3088 flex system as an enhanced model to the S3088-III. Like its predecessors, the S3088 flex is distinguished by a highly effective electronics assembly inspection, but also offers important advancements for future viability, system performance and operation. Vi TECHNOLOGY introduces the 2K PERFORM AOI solutions.10 May 2011 - Vi TECHNOLOGY introduces the 2K PERFORM, a compact and affordable AOI solution, designed to meet small and medium size application. Its small footprint offers 14” x 14” boards capability with the same performances as the 3K, 5K and 7K series. The equipment utilizes the P Series acquisition heads including the i-LITE illumination system, the Vi TECHNOLOGY's latest software suite and is approved for today’s 01005 challenges thanks to the Selective Super-resolution technology. Application Services for Agilent AXI Systems09 May 2011 – MatriX Technologies, a manufacturers of automatic x-ray inspection solutions in the field of electronics and NDT, now provides – in addition to its own AXI product series for electronic production (XT1300, X2 and X2.5) - an extended package of service and application support for the Agilent Medalist 5DX and X6000 AXI systems. In 2009 Agilent had completely stopped the production of automatic x-ray systems for SMT solder joint inspection in the course of restructurings. More Articles ...
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