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News - Board and System TestNew Modular Functional Test System for Automotive Electronics07 April 2011 – Agilent Technologies introduced the Agilent TS-8900 Automotive Functional Test System – an off-the-shelf, standardized PXI-based solution that offers unsurpassed test coverage and speed for use in automotive electronics test applications. It is especially suited for testing medium- to high-pin-count electronic control units. ORPRO Vision launches new Benchtop AOI System04 April 2011 - The new Insite B Bench Top AOI combines the performance of ORPRO Vision’s proven technology with the benefits of a small, manually operated, and cost effective system for Post Placement inspection. Insite B is powered by ORPRO Vision’s Novus software, featuring µFlow inspector technology and features a compact, light and rigid Optical Head, capable of supporting up to five high speed, high resolution color cameras. JTAG-based embedded Debugger for Intel x86 Systems01 April 2011 – A new embedded debugger from ASSET InterTech is the first in-system JTAG-based debugger for Intel x86 platforms. Based on ASSET’s ScanWorks platform for embedded instruments, the debugger implements hardware-based run control in system firmware. Once the debugger has been installed, systems can be debugged remotely from anywhere and at anytime with no external JTAG emulator hardware. Precision Power Analyser combines Accuracy with Wideband Performance01 April 2011 - TTid has been appointed by N4L (Newtons4th Ltd.) to provide distributor support in the UK for the new PPA1500 Series of power analysers. The PPA1500 is available as a 1-, 2- or 3-channel model and a frequency range of up to 1 MHz. A calibrated internal shunt with a unique 10x gain mode makes the PPA1500 ideally suited to standby power measurements. LTE Test Mobile supports Beamforming and 4 x 2 MIMO29 March 2011— Aeroflex announced that the TM500 LTE test mobile has increased the number of modes it supports to include user equipment (UE) beamforming and 4 x 2 MIMO, as specified in Release 8 of the Third Generation Partnership Project (3GPP) Long Term Evolution (LTE) standard. Boundary Scan Support throughout the entire Product Life Cycle25 March 2011 - GOEPEL electronic introduces the support of multi protocol interface chips from the British company Future Technology Devices International (FTDI) for their utilisation as native Boundary Scan controllers. The single-chip solutions with USB2.0 control will be used in the recently developed PicoTAP Boundary Scan controllers. Additionally, they can be included in customer designs to implement onboard system-level JTAG applications. Aeroflex extends Capability of PXI 3000 Series with LTE TDD Measurement Suite24 March 2011— Aeroflex announced the launch of a new software measurement suite for its PXI 3000 Series of modular instruments, to support the Time Division Duplex (TDD) mode of 3GPP Long Term Evolution (LTE) – also known as TD-LTE. The LTE TDD Measurement Suite provides LTE TDD chipset, handset and terminal device manufacturers with the advanced test capability they need to rapidly characterize device performance. More Articles ...
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