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Readers Top 5 News of last 30 days
News - Component TestPick-and-Place Handler offers one Insertion Multi-Temperature Testing15 May 2015 - The Multitest MT2168 pick-and-place handler now offers multi-temperature test with only one insertion. The highly dynamic temperature control allows for testing at multiple set temperatures within one plunger cycle. This new feature particularly addresses the requirements in design and engineering sites. The fast and accurate changes of the set temperatures are based on the chamberless soaking solution in the contact unit of the MT2168. Multipurpose Module for IC Failure Capture28 April 2015 — Cascade Microtech introduced a new Multipurpose Electromigration (MPEM) module featuring an intuitive, full-featured test suite for predicting the lifetime and reliability of copper interconnects in modern integrated circuits. Cascade Microtech’s new MPEM module offers researchers a broadly capable tool with multiple electromigration (EM) test applications in one convenient, low-cost, high-performance system. High g Sensor Test Module for Gravity Handler21 April 2015 - Multitest shipped the first “Shaker” 45° high g sensor test module for the MT9928 to a major international IDM. The module allows for a two axis testing with one single stimulation on a flexible and modular handler platform. The well-established “Shaker” module, which was originally available for the MT93xx only, is now also available for the flexible and modular MT9928 gravity handler. Characterizing all Key Parameters of Semiconductor Power Devices20 April 2015 – Keysight Technologies introduced significant enhancements to the B1505A Power Device Analyzer/Curve Tracer, making it the industry’s only solution able to characterize all key parameters of on-wafer and packaged devices for modern semiconductor power device development. The instrument measures Ciss, Coss, Crss, Gate Charge/Resistance and performs Automatic Thermal Testing. Test Probe evaluated in high Volume Semiconductor Production Test14 April 2015 - Everett Charles Technologies (ECT) successfully passed a two month evaluation of ZIP probes using the HyperCore material option in a high volume production environment at a large OSAT in Singapore. The ZIP probe exceeded the critical first pass yield expectations and beat the target for a 500 k insertions life time by over 20%. Flying Probe Tester for Substrates down to 10 µm30 March 2015 - atg Luther & Maelzer introduced a flying probe system for substrate test. The first system was deliverd to a major customer in Korea. The S3 10µm Substrate Tester is the first system of a new atg Luther & Maelzer product line. It meets the challenging requirements of high end substrate test such as positioning accuracy and high number of contact points by applying the advanced flying probe technology of atg Luther & Maelzer. Digital Stimulus/Response Module for RF Chipset Test Systems27 March 2015 – Keysight Technologies introduced a high-speed, 16-channel PXIe digital stimulus/response module with a parametric measurement unit (PMU). The module provides fast and flexible RF chipset test emulation and device characterization for test engineers in design validation and production test. More Articles ...
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