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News - Component Test
Hioki launches new Insulation Tester23 July 2014 - Hioki E.E. Corporation launched the Insulation Tester ST5520. In order to ensure the safety of electronic components such as relays and connectors and of lithium-ion and other batteries used in electric vehicles and smartphones, it is necessary to qualify their insulation characteristics, and testing system manufacturers vie to offer instruments capable of high-volume, high-speed testing.
aps Solutions builds a Repair and Support Centre in Dresden, Germany22 July 2014 – aps Solutions GmbH (“APS”) announces their decision to open a Repair and Service Centre for ‘state of the art’ high performance Vertical Probe Card technologies.
1.6-Gbps Digital Module enabling Protocol-Aware SoC Testing18 July 2014 – Advantest introduced a new T2000 1.6GDM digital module, designed to improve efficiency in testing system-on-chip (SoC) devices on the T2000 test platform. The 1.6-Gbit-per-second module incorporates a new feature called Functional Test Abstraction Plus (FTA+) to achieve protocol-aware testing, in which the tester communicates directly with the devices under test (DUTs) in each IC’s protocol language. A powerful EDA-Link, called FTA-Elink, connects the design simulator to the T2000 test platform directly.
Automatic Fixture Removal Option for Network Analyzer14 July 2014 – Agilent announced a powerful new automatic fixture removal (AFR) option for its PNA Series network analyzers. Previously available only in Agilent’s Physical Layer Test System (PLTS) software, the error-correction technique offers a fast and easy way to accurately measure non-coaxial devices, saving engineers time and money.
Teradyne and Test Insight partner to Shorten IC Design Cycle Times10 July 2014 - Teradyne and Test Insight released new pattern conversion solutions for UltraFLEX digital instruments to reduce design to test cycle times and expedite Silicon debug and characterization. The new solutions include the ability to compile hundreds of patterns in parallel using Linux-based Load Share Facilities (LSF) as well as the ability to produce binary IG-XL pattern files directly from electronic design automation (EDA) output formats.
Advantest introduces new Device Power Supply for T2000 Test Platform03 July 2014 – Advantest announced its new T2000 Enhanced Device Power Supply 150A (DPS150AE) module that enables its T2000 test platform to handle the load requirements for highly accurate testing of both high-current and low-voltage semiconductors, including microprocessor units (MPUs), application-specific ICs (ASICs) and field-programmable gate arrays (FPGAs).
Boston Semi Equipment acquires MVTS Technologies01 July 2014 – Boston Semi Equipment LLC (BSE) has completed the acquisition of MVTS Technologies (MVTS). BSE and MVTS are industry leaders in the market for reconfigured automated test equipment (ATE). The combination of the product lines, service offerings and global reach of both companies has created a single, comprehensive source for companies seeking ATE equipment solutions from the secondary market. More Articles ...
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